WMSIC Electronic Components

RENESAS 8535AGI-01LF 8535AGI

Model8535AGI-01LF
Package20-TSSOP
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS 8535AGI-01LF
Type
RENESAS
Unit
Electronic Component
Minimum package
74 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
8535AGI-01LF
Electronic Component
1
Package
20-TSSOP
Electronic Component
Clock Buffer / Driver / Distributor
Electronic Component
0.17g
Electronic Component
1
Features
Output /; and; / Isolated Driver
Electronic Component
BM0258714410
Operating Temperature
40℃~+85℃
Operating Voltage
3.135V~3.465V
Channel Count
2
Output Channel Count
4
Output Frequency
266MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RENESAS 8535AGI-01LF 产品概述

一、概览

8535AGI-01LF 是瑞萨(Renesas)推出的一款高性能时钟缓冲器,功能定位为 2:4 时钟分配(2 输入,4 输出),最大输出频率可达 266 MHz,封装为 20 引脚 TSSOP。器件工作电压范围为 3.135 V 至 3.465 V,工作温度范围 -40 ℃ 至 +85 ℃,适合工业级与商用级混合场景的时钟分配与驱动需求。

二、主要技术参数

  • 最大输出频率:266 MHz
  • 供电电压:3.135 V ~ 3.465 V(典型 3.3 V 系统兼容)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 功能:2:4 时钟缓冲 / 分配
  • 封装:20-TSSOP(20 引脚薄小型封装)
  • 品牌:RENESAS(瑞萨)

三、功能特点

  • 支持高达 266 MHz 的时钟驱动,满足中高速系统的时钟需求。
  • 2 输入、4 输出的拓扑结构,便于将两个源或一个经选择的源分发到最多四个负载。
  • 工作电压接近 3.3 V,兼容主流 FPGA、ASIC、通信与存储接口的电平要求。
  • 宽温度范围,适用于工业级应用。
  • 20-TSSOP 封装,体积小,便于 PCB 布局与密集系统集成。

四、典型应用

  • FPGA/ASIC 的时钟分发与缓冲
  • 网络通信设备(以太网交换、路由)时钟架构
  • 存储接口(DDR 前端时钟分发应用需根据速率匹配)
  • 视频/多媒体处理链路中的时钟同步
  • 工业控制与测量系统的定时与分频前端

五、设计与布局建议

  1. 电源与去耦:在器件 VCC 引脚附近放置 0.1 µF 陶瓷去耦电容,尽量靠近引脚并接地平面,抑制供电噪声与瞬态。
  2. 接地处理:使用完整的接地平面,减少时钟线的回路面积,降低 EMI 与串扰。
  3. 信号完整性:对高频输出走线采用受控阻抗和尽可能短的走线,必要时在输出端并联或串联阻尼(如 22–33 Ω)以减少反射与振铃。
  4. 时序匹配:对关键路径进行差分或单端等长度布线,保证时序对齐与抖动预算。
  5. 热与封装:TSSOP 封装热阻较小,正常工作下不需要额外散热片,但在高密度板或高环境温度下应评估功耗与温升。

六、可靠性与采购

  • 器件工作温度覆盖工业级范围(-40 ℃ 至 85 ℃),适合多数严苛应用。
  • 建议通过正规渠道采购以确保原厂质量与可追溯性,产品料号:8535AGI-01LF(RENESAS)。
  • 在最终设计投入批量生产前,应结合系统实际负载与时序要求进行仿真与评估(包括功耗、抖动与信号完整性测试)。

如需器件的详细电气特性曲线、引脚分配图、典型应用电路或封装外形尺寸图,建议查看瑞萨官方数据手册或联系供应商获取原厂资料,以便完成精确的硬件设计与验证。

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