WMSIC Electronic Components

RENESAS 9DB433AGILFT

Model9DB433AGILFT
Package28-TSSOP
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
RENESAS 9DB433AGILFT
Type
RENESAS
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
9DB433AGILFT
Electronic Component
1
Package
28-TSSOP
Electronic Component
Clock Buffer / Driver / Distributor
Electronic Component
0.21g
Electronic Component
1
Features
Built-in; Clock /; Output
Electronic Component
BM0264679275
Operating Voltage
3.3V
Channel Count
1
Output Channel Count
4
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

9DB433AGILFT 产品概述

一、概述

9DB433AGILFT 是瑞萨(RENESAS)推出的一款面向高性能串行链路和系统时钟分配的零延迟扇出缓冲器(Zero Delay Buffer, ZDB)。器件支持单输入四输出,工作电压 3.3V,最高工作频率可达 166MHz。内置锁相环(PLL)实现输入时钟与输出时钟的相位对齐,适用于 PCI-Express(PCIe)及其它高速接口的时钟分配和整形。

二、主要功能特性

  • 单输入、四路输出结构,简化板级时钟分配拓扑。
  • 内置 PLL,实现零延迟(输出与输入保持相位同步)和多路驱动能力。
  • 支持扩展频谱(Spread Spectrum)功能,便于系统 EMI 优化。
  • 低抖动时钟重整/清抖(clock cleaning),改善输入抖动并提供稳定的输出时钟。
  • 含输出使能/关断控制,便于功耗管理与热插拔场景。
  • 封装为 28-TSSOP,适合中高密度 PCB 布局与量产装配。

三、典型规格要点

  • 输入通道:1;输出通道:4。
  • 工作电压:3.3V。
  • 工作频率范围:可支持至 166MHz(具体性能与抖动指标请参见器件说明书)。
  • 相位关系:零延迟/相位对齐;输出可与输入同步锁定。
  • 控制功能:输出使能/关断与扩展频谱配置(由引脚或寄存器控制,详见规格书)。

四、典型应用场景

  • PCIe 主板与扩展卡的时钟扇出与分配。
  • FPGA/ASIC 时钟树驱动与时钟清洗。
  • 服务器、存储与网络设备的多路时钟分配。
  • 需 EMI 管控的系统(利用扩展频谱功能降低电磁辐射)。

五、封装与选型建议

器件采用 28-TSSOP 封装,适用于自动贴装生产。选型时应参考系统频率、输出驱动能力、抖动容限以及是否需扩展频谱功能;若需多通道或更高频率,可考虑同系列或替代型号。建议下载并参照瑞萨官方数据手册获取完整引脚分配与电气特性。

六、设计注意事项

  • 电源去耦:芯片电源引脚附近放置足够的陶瓷电容以抑制噪声。
  • 布线:输出走线需控制阻抗并尽量匹配长度,避免不必要反射。
  • PLL 锁定:关注上电序列与锁相时间,必要时在系统中加入复位/启用序列。
  • EMI/散热:启用扩展频谱可降低 EMI;高密度应用关注封装散热与板上热管理。
  • 引脚保护:按数据手册处理输出使能及 I/O 过压/ESD 情况。

七、参考与支持

有关详细电气特性、引脚定义、时序图和应用电路,请参阅瑞萨官方数据手册与参考设计。对于特定系统集成问题,可联系供应商或瑞萨技术支持获取应用建议与验证资料。

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