Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RENESAS R7F701374AEAFP-C#BA1 R7F701374AEAFP
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RENESAS R7F701374AEAFP-C#BA1
- Type
- RENESAS
- Minimum package
- 720 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RENESAS
- Electronic Component
- R7F701374AEAFP-C#BA1
- Electronic Component
- 1
- Package
- LFQFP-144(16x16)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0.885g
- CPU
- 32 Bit
- CPU
- Other
- Electronic Component
- 1
- ADC
- 12bit
- Electronic Component
- BM0264582808
- Operating Voltage
- 3V~3.6V
- CPU
- 24MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 720
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
R7F701374AEAFP-C#BA1 产品概述
一、概述
R7F701374AEAFP-C#BA1 是瑞萨（RENESAS）旗下基于 RH850 系列架构的高性能微控制器。器件为 32 位双核设计（RH850/P1M-C），每核主频可达 240MHz，片上程序存储为 2MB（2M x 8）FLASH，封装为 144 引脚 LFQFP（16×16 mm），适合对实时性和可靠性要求较高的汽车与工业控制应用。
二、核心与存储
- CPU：32 bit 双核架构，单核主频 240MHz，满足复杂控制与并行任务处理的需求。
- 程序存储：2MB FLASH（2M x 8），支持固件容量与 OTA 更新需求。
- 工作电压：3.0V ~ 3.6V，便于车载与标准工业供电设计。
三、模数与外设能力
器件集成 12-bit ADC（多通道），适用于传感器采集与闭环控制。结合高速内核与丰富外设（常见于 RH850 系列），可实现高精度采样与实时控制回路。FLASH 存储与外设接口使得系统固件与数据管理更为灵活。
四、封装与设计注意事项
- 封装：LFQFP-144（16×16 mm），引脚数充足，便于布线与多外设扩展。
- PCB 设计：注意电源去耦、地平面完整性与敏感信号隔离，防止高频内核对模拟前端干扰。
- 散热与可靠性：在高负载或车载环境下考虑热设计与稳压保护，保证长期稳定工作。
五、典型应用
- 汽车领域：发动机控制单元（ECU）、底盘控制、电机驱动与网关控制器等；
- 工业控制：高精度伺服驱动、运动控制、实时监控系统等；
- 其他需要高实时性与多通道采样的嵌入式系统。
总结：R7F701374AEAFP-C#BA1 凭借 RH850 系列的高性能双核架构、充足的 FLASH 存储与 144 引脚 LFQFP 封装，为对实时性、可靠性与外设扩展有较高要求的车载与工业控制应用提供了一种稳健的解决方案。在设计时应重点关注电源完整性、模拟信号隔离与热管理，以发挥器件性能并保证长期可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
