WMSIC Electronic Components

RENESAS R5F1027AANA#05 R5F1027AANA

ModelR5F1027AANA#05
PackageHWQFN-24(4x4)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R5F1027AANA#05
Type
RENESAS
Unit
Electronic Component
Minimum package
3920 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R5F1027AANA#05
Electronic Component
1
Package
HWQFN-24(4x4)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.09g
CPU
RL78
I / O
22
Electronic Component
1
ADC
10bit
EEPROM
2KB
Electronic Component
BM0257410098
Operating Voltage
1.8V~5.5V
CPU
24MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R5F1027AANA#05 产品概述

一、产品简介

R5F1027AANA#05 是瑞萨(RENESAS)基于 RL78 内核的 16 位微控制器,核心最高主频 24 MHz,程序闪存容量 16 KB,内部 EEPROM 2 KB,片上 I/O 引脚 22 个,10 位分辨率 ADC,工作电压范围宽为 1.8 V 至 5.5 V。封装为 HWQFN-24(4×4),适合空间受限且要求低功耗的嵌入式应用。

二、主要特性

  • 低功耗 16 位处理能力,适合控制与测量类任务;
  • 16 KB FLASH 提供足够的代码空间用于常见控制算法与通信协议实现;
  • 2 KB EEPROM 适合保存参数、校准数据及小量日志;
  • 10-bit ADC 满足多数传感器采集精度要求;
  • 宽电压输入(1.8–5.5 V)便于与多种电源系统兼容;
  • 小型 HWQFN-24 封装利于紧凑型产品设计。

三、典型应用场景

适用于便携设备、传感器节点、家用小家电、按键/背光控制、简单工业控制与仪表等需要低功耗、少量 I/O 和中等处理能力的场合。

四、选型与设计建议

  • 电源与去耦:建议在 VCC 近端放置 0.1 μF 陶瓷去耦,并按应用考虑 1 μF~10 μF 的电源滤波;
  • ADC 设计:为保证 ADC 精度,应提供稳定的参考电压并对输入做必要的抗混叠滤波;
  • EEPROM/FLASH 使用:EEPROM 写次数有限,应做磨损均衡与必要的校验;FLASH 空间有限,注意代码与数据分区优化;
  • 引脚与封装:HWQFN-24 带底垫,布局时注意焊盘与散热、接地运行;
  • 调试与开发:建议使用瑞萨官方开发环境与调试工具进行固件开发与烧录,以提高开发效率。

五、总结

R5F1027AANA#05 提供了在低功耗与小封装下兼顾控制性能与模拟采集能力的解决方案,适合以成本与功耗为优先的嵌入式设计。针对具体项目,应结合外设需求、存储与电源方案进行系统优化。

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