WMSIC Electronic Components

RENESAS CA3130MZ

ModelCA3130MZ
PackageSOIC-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS CA3130MZ
Type
RENESAS
Minimum package
100 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
CA3130MZ
Electronic Component
1
Package
SOIC-8
Electronic Component
Operational Amplifier
Electronic Component
0.147g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0259461828
Operating Temperature
55℃~+125℃
Amplifier
1
Output Current
22mA
(SR)
30V/us
Power Supply Voltage
5V~16V
Static Current(Iq)
300uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CA3130MZ 产品概述

一、概述

CA3130MZ 是 RENESAS(瑞萨)提供的一款通用单路运算放大器,封装为 SOIC-8,面向表面贴装应用。器件以低静态电流、MOS 型输入和较宽的带宽/高压摆率为特点,适合对输入偏置电流要求高且需要轨到轨输出的便携式与工业级模拟电路。

二、关键规格(概览)

  • 放大器路数:单路
  • 电源范围:单电源 5V ~ 16V;双电源可支持 ±2.5V ~ ±8V(建议按设计要求选择)
  • 轨到轨输出:支持,便于低电压系统输出摆幅利用率
  • 增益带宽积(GBP):15 MHz
  • 压摆率(SR):30 V/µs
  • 输入失调电压 Vos:典型 8 mV,温漂 10 µV/℃
  • 输入偏置电流 Ib:典型 5 pA;失调电流 Ios:0.5 pA(MOS 输入低漏电)
  • 共模抑制比 CMRR:90 dB
  • 静态电流 Iq:300 µA(典型)
  • 输出电流:22 mA(峰值驱动能力)
  • 工作温度:-55 ℃ ~ +125 ℃
  • 封装:SOIC-8,便于自动贴片与批量生产

三、典型应用场景

  • 仪表前端放大、光电/传感器信号调理(得益于极低的输入偏置电流)
  • 精密缓冲器与输入级(轨到轨输出适合低压系统)
  • 有源滤波器、积分器、低噪比放大器
  • 数据采集驱动、采样保持前级及低功耗模拟电路

四、设计与使用要点

  1. 电源与去耦:建议在靠近器件电源引脚放置 0.1 µF 陶瓷去耦电容,并并联 10 µF 以上电解或薄膜电容以优化低频稳定性与瞬态响应。
  2. 输入保护:虽然为 MOS 输入、偏置电流极小,但对静电与反向电压敏感,输入端避免超过电源轨的过压,必要时并联限流电阻与保护二极管。
  3. 稳定性与回路增益:GBP 15 MHz 与 SR 30 V/µs 使其在中高增益下表现良好;在低增益或驱动容性负载时,应加入阻尼或小电容补偿以防振荡。
  4. 输出与驱动能力:22 mA 的输出能力适合驱动一般模拟负载,但若驱动低阻负载或电磁继电器等大电流器件,应加外部驱动级。
  5. 温漂与校准:Vos 约 8 mV 且温漂 10 µV/℃,用于高精度应用时可通过外部校准或温度补偿降低长期误差。

五、封装与资料

CA3130MZ 提供标准 SOIC-8 表面贴装封装,利于自动化组装。在实际电路设计中,请以 RENESAS 官方数据手册为准获取详细引脚定义、最大额定值、典型特性曲线以及建议的 PCB 布线规则。

总结:CA3130MZ 以低偏置电流、轨到轨输出与适中的带宽/压摆率为优势,适合精密传感器接口、低功耗模拟前端及通用放大器应用。针对具体应用场景,合理的电源去耦、输入保护与负载匹配能发挥其最佳性能。

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