Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RICHTEK RT6363GSP
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RICHTEK RT6363GSP
- Type
- RICHTEK
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RICHTEK
- Electronic Component
- RT6363GSP
- Electronic Component
- 1
- Package
- SOP-8-EP
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.28g
- Electronic Component
- 1
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0257640894
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 4V~60V
- Switching Frequency
- 2.5MHz
- Electronic Component
- Electronic Component
- Output Voltage
- 800mV~60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RT6363GSP 产品概述
产品名称：RT6363GSP
类型：可调降压DC-DC电源芯片
品牌：RICHTEK（台湾立锜）
封装：SOP-8-EP
一、产品背景
在现代电子设备中，对电源管理的需求愈发重要。随着各类电子产品的广泛应用，如手机、平板、工业设备及电动车等，高效、可靠的电源解决方案成为设计工程师的一项关键考量。RT6363GSP作为一款高性能的可调降压型DC-DC电源芯片，设计用于满足这些市场需求，通过其卓越的电压调节能力来确保设备的稳定工作。
二、产品特点
输入电压范围： RT6363GSP能够接受广泛的输入电压范围，从4V至60V。此特性使其在各种应用中具备良好的兼容性，不论是来自电瓶、适配器还是其他电源，RT6363GSP都能高效工作。
输出电压调节： 该芯片的输出电压可调范围为800mV至60V。这样宽的输出调节范围，使得RT6363GSP可以满足各种负载需求，且用户可以根据具体应用灵活调节输出电压值。
高效率： RT6363GSP在降压转换过程中，能够实现极高的能量转换效率，这不仅提高了整个电路的性能，还减少了发热量，对 PCB 的布局设计提供了更大的灵活性。
封装和散热： 采用SOP-8-EP封装，RT6363GSP具备良好的散热性能，可有效处理高功率应用中的热管理挑战。其有利的引脚布局也便于进行PCB设计与走线。
保护功能： RT6363GSP内置多种保护功能，包括过流保护、过压保护和热关断等。这些保护机制可有效防止芯片在不同工作条件下的损坏，增强了系统的可靠性。
简易应用： 作为一款可调芯片，RT6363GSP简化了设计过程。其参考电压源和反馈机制使得工程师能轻松设计符合特定需求的电源输出，减少了开发时间和成本。
三、应用领域
RT6363GSP的灵活性和高效性能使其广泛应用于多个领域：
工业设备：可用于工业自动化设备的电源管理，确保设备在各种环境和负载条件下的稳定工作。
汽车电子：在汽车电气系统中作为降压电源，为各种电子模块提供可靠的电源支持，包括导航、娱乐和安全系统。
通信设备：满足基站、路由器及其附属设备的电源需求，提供稳定的电源输出以保证长时间的运营。
消费电子产品：可用于手机、平板电脑和其他便携式设备，满足快速充电和高能效的要求。
LED驱动：在LED照明和显示应用中提供必要的降压支持，确保亮度稳定，并延长LED的使用寿命。
四、总结
RT6363GSP作为一款高效的可调降压型DC-DC电源芯片，其宽广的输入输出电压范围、高效率、可靠的保护机制和灵活的应用特性，使其成为多个领域电源管理的理想选择。无论是在工业、汽车还是消费电子产品中，RT6363GSP都能够为设计工程师提供强大而灵活的电源解决方案，助力电子产品在市场上获得竞争优势。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
