WMSIC Electronic Components

RICHTEK RT5753AHGQWA

ModelRT5753AHGQWA
PackageWDFN-8-SL(2x2)
BrandRICHTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RICHTEK RT5753AHGQWA
Type
RICHTEK
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RICHTEK
Electronic Component
RT5753AHGQWA
Electronic Component
1
Package
WDFN-8-SL(2x2)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.064g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265006336
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
1.2MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RT5753AHGQWA 产品概述

一、概述与主要规格

RT5753AHGQWA 是台湾 RICHTEK 推出的降压型同步开关稳压器,采用降压拓扑、内置功率开关,单通道可调输出。主要电气参数:输入电压 2.5V~5.5V,输出电压可调 0.6V~5.5V,最大输出电流 3A,开关频率 1.2MHz;工作结温范围 -40℃~+125℃。封装为 WDFN-8-SL (2 × 2 mm),适用于对尺寸与效率有较高要求的点对点供电场合。

二、关键特性与优势

  • 高集成度:内置高低侧功率 MOSFET,简化外部器件选型和布局,提高系统可靠性。
  • 高频率开关:1.2MHz 工作频率允许采用体积更小的电感与电容,有利于小型化设计。
  • 宽输入与输出范围:支持 2.5V~5.5V 输入与 0.6V 可调起始输出,适配多种电源与负载需求。
  • 同步整流:提高转换效率、降低功耗,尤其在中等到高负载下更明显。
  • 工业级温度范围:-40℃~+125℃@TJ,适用于工业与消费类产品。

三、典型应用场景

  • 电池供电与便携设备的主/次级降压转换(例如便携终端、手持设备)。
  • 单板或模块的点对点供电,为 MCU、FPGA、射频前端或传感器供电。
  • 工业控制与通信设备中的局部稳压模块,需兼顾体积与散热限制的场合。

四、设计与选型建议

  • 输入电容建议使用低 ESR 陶瓷电容,靠近 VIN 与 GND 引脚布置以抑制开关噪声。
  • 输出滤波器(电感与电容)应根据所需输出纹波、效率与响应速度选型;1.2MHz 高频允许选择小型电感(注意饱和电流高于峰值电流)。
  • 反馈网络(设定 VOUT 的分压电阻)应靠近 FB 引脚放置,走线最短并与地平面良好连接以保证输出稳压精度。
  • 若需软启动、使能或远程检测,应参考器件数据手册正确连接相应引脚以免启动浪涌或失稳。

五、封装与热管理

WDFN-8(2×2) 紧凑封装利于板面空间节省,但热性能依赖于 PCB 的散热设计。建议在 PCB 走大面积内/底层散热铜箔并焊接过孔至内层,以降低结到环境热阻,保证在高负载下稳定工作。

六、注意事项与资料获取

RT5753AHGQWA 在实际工程应用中表现出体积小、效率高、适用范围广的优点,但具体的保护功能、误差容限及外围元件推荐请以官方数据手册为准。工程选型时应关注启动特性、动态响应、效率曲线及热升参数,并在样机板上做负载、瞬态与热循环测试以验证系统可靠性。

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