WMSIC Electronic Components

RICHTEK RT9198-33GBR RT9198

ModelRT9198-33GBR
PackageSOT-23-5
BrandRICHTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RICHTEK RT9198-33GBR
Type
RICHTEK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
330mV@(300mA)
Electronic Component
RICHTEK
Electronic Component
RT9198-33GBR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.025g
Electronic Component
1
Features
Output
Electronic Component
BM0264871446
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
3.3V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RT9198-33GBR 产品概述

一、主要特性

RT9198-33GBR 是 RICHTEK(立锜)推出的一颗固定输出 3.3V 线性稳压器(LDO),采用 SOT-23-5 封装,面向便携及低功耗系统。主要参数包括:最大工作电压 5.5V,固定输出 3.3V,最大输出电流 300mA,静态电流(Iq)约 130μA,10kHz 下 PSRR 约 30dB,300mA 负载时压差约 330mV。器件集成使能控制、输出放电、过流保护和热关断等常用功能,单通道输出,工作结温范围 -40℃~+125℃(Tj)。

二、典型电气参数

  • 输入电压上限:5.5V(芯片最大工作电压,实际应用请参考数据手册)
  • 输出电压:3.3V(固定)
  • 输出电流:最大 300mA
  • 压降(Dropout):≈330mV @ 300mA(因此满载时输入需≥约3.63V)
  • 静态电流:约 130μA,适合电池供电的低静耗应用
  • PSRR:30dB @ 10kHz,可抑制中高频输入纹波

三、功能与保护

RT9198-33GBR 提供常见的系统级功能:

  • 使能(EN)控制:外部控制芯片上电/关断,支持系统省电模式;具体阈值请参阅规格书。
  • 输出放电:关断时通过内部电路快速放电输出,避免残留电压影响下游电路。
  • 过流保护(OCP):在短路或过载时限制电流,保护器件与系统。
  • 热关断:在器件过热时自动关断,防止损坏并在冷却后恢复工作。

四、典型应用场景

适合各种需要稳定 3.3V 电源的终端,包括但不限于:便携式消费类电子、物联网节点、MCU 与传感器供电、无线模块、电池供电设备与工业控制等。低静耗和输出放电功能对待机省电与快速复位场景尤为有利。

五、设计与布局建议

  • 输入端加 1μF10μF 陶瓷电容(X7R/X5R),靠近 VIN 引脚放置以降低输入纹波与瞬态响应;输出端同样使用 1μF10μF 低 ESR 陶瓷电容以保证稳压器稳定性,具体容值与 ESR 要求请以数据手册建议为准。
  • EN 引脚可直接与 MCU 或上电复位电路相连,若不使用需按手册建议拉到使能电平以避免误工作。
  • 布局时尽量缩短 VIN、VOUT 到电容的走线,GND 做单点接地,SOT-23-5 的散热能力有限,应通过铜箔扩展底层散热以降低结温。

六、热设计与功耗估算

线性稳压器的功耗与 Vin-Vout 和负载电流直接相关:Pd = (Vin - Vout) × Iout。以最大输入 5.5V、输出 3.3V、300mA 负载为例,Pd = (5.5-3.3)V × 0.3A = 0.66W。SOT-23-5 封装在此功耗下需考虑 PCB 散热与负载周期性,必要时降低持续负载电流或增加铜面积以控制结温,避免触发热关断。

七、封装与选型提示

RT9198-33GBR 标准封装为 SOT-23-5,适合空间受限应用。选型时注意:确认系统最大输入电压、所需最大输出电流及热预算是否匹配;输出电容类型与容量对 LDO 稳定性影响较大,使用前请参考 RICHTEK 官方数据手册获取详细引脚功能表、EN 阈值、保护参数及典型应用电路图。

如需在具体电路中采用 RT9198-33GBR,可提供您的输入电压范围、最大负载以及 PCB 尺寸与散热条件,我可以帮您做更具体的布局与热设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.