WMSIC Electronic Components

RICHTEK RT6254BHGJ6F

ModelRT6254BHGJ6F
PackageTSOT-23-6
BrandRICHTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RICHTEK RT6254BHGJ6F
Type
RICHTEK
Minimum package
3000

Technical parameters

Electronic Component
RICHTEK
Electronic Component
RT6254BHGJ6F
Electronic Component
1
Package
TSOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.056g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230063867
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
4.5V~18V
Switching Frequency
500kHz
Electronic Component
Electronic Component
Output Voltage
600mV~5V
Output Current
4A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RT6254BHGJ6F 产品概述

一、简介

RT6254BHGJ6F 是一款降压型(Buck)同步整流 DC-DC 开关稳压器,面向要求高效率、小尺寸和中等功率的点负载电源场合。器件内部集成高侧与低侧开关管,采用固定开关频率 500kHz 的 PWM 控制,输入电压范围宽(4.5V~18V),输出电压可调(0.6V~5.0V),最大输出电流可达 4A,适用于嵌入式系统、便携与工业设备的主/辅助供电。

二、主要规格与特性

  • 功能类型:降压型(同步整流)
  • 输入电压范围:4.5V ~ 18V
  • 输出电压范围:0.6V ~ 5.0V(可调)
  • 最大输出电流:4A
  • 开关频率:500kHz(典型值)
  • 静态电流(Iq):约 115µA(轻载低功耗特性)
  • 工作温度:-40℃ ~ +85℃(TA)
  • 开关管:内置 N 沟 MOSFET(同步整流)
  • 输出通道数:1(单输出)
  • 封装:TSOT-23-6
  • 典型优势:高集成度、较低静态电流、适合电池供电系统与空间受限的应用

三、典型应用场景

  • 电池供电的便携式设备与测量仪器
  • 嵌入式主板的点负载(CPU、CMOS、外设供电)
  • 通信设备与路由器的辅助电源
  • 工业控制模块、车载电子(须考虑更严的温度/EMI 要求时验证)
  • LCD/摄像模组及传感器供电

四、设计要点与外设选型

为确保稳定性、效率与可靠性,设计时建议注意以下几点:

  1. 输出电压设定

    • 利用外部分压电阻设定输出电压:Vout = Vref × (1 + Rtop/Rbot),其中 Vref = 0.6V(典型)。
    • 例如欲设 Vout = 3.3V,则 Rtop/Rbot = 3.3/0.6 - 1 ≈ 4.5。
  2. 电感选择

    • 开关频率 500kHz,有利于使用较小电感尺寸。选型原则:电感电流纹波 ΔIL 保持在峰值电流允许范围内且保证连续导通模式(CCM)或适当的 DCM。
    • 纹波电流近似:ΔIL = (Vin - Vout) * D / (L * f)(其中 D 为占空比 ≈ Vout/Vin,f 为开关频率),由此解得 L。
    • 电感电流额定值需大于峰值电流(Iout + ΔIL/2),并注意饱和电流与温升。
  3. 电容选型

    • 输入电容:建议采用低 ESR 陶瓷电容(X7R/Y5V),10µF~47µF,放置靠近芯片 VIN 与 GND 引脚以抑制瞬态电压尖峰。
    • 输出电容:选择低 ESR 的多层陶瓷电容以保证输出稳定与低噪声,典型 10µF~100µF,必要时并联小容值以改善高频性能。
  4. PCB 布局要点

    • 将 VIN、GND 和 SW 回路的输入电容、输出电容与芯片靠得最近,尽量缩短高频回路走线以减小回路面积。
    • 将功率回路(VIN、SW、GND、电感)与敏感模拟走线分开,保证良好散热通路和地回路设计。
    • 对于 TSOT-23-6 小封装,增加铜箔面积有助于散热。
  5. 保护与启动(设计建议)

    • 虽器件自带同步整流机制以提高效率,但在系统设计中仍建议考虑输入浪涌限流、软启动与上电顺序(EN/ON 控制)以保护负载与减小启动电流冲击。
    • 输出滤波与负载突变时考虑峰值电流余量,必要时选用具有更高电流裕量的电感与更大容量的输出电容。

五、封装与热管理

  • 封装:TSOT-23-6,适合空间受限应用,但热阻较软封或散热片高。实际使用中应通过较大铜面积的 PCB 散热(VIN、GND 区域)来降低结温。
  • 温度与功率限制:在高环境温度或靠近最大输入/输出条件下,应进行热仿真与实际测试,必要时采用降额工作或外部散热措施。

六、快速选型与参考建议

  • 若需高效率且体积小的 4A 点负载电源,RT6254BHGJ6F 是合适的选择;若需更高输出电流或扩展工作温度范围,可考虑对应系列更高规格器件。
  • 设计开始时建议:先在评估板或参考设计上验证稳定性、效率与热性能,再把关键元件(电感、电容、分压电阻)按实际 PCB 布局重新优化。
  • 如需完整电气特性、引脚定义、典型应用电路与布局参考,请参考 RICHTEK 官方数据手册与应用笔记,或联系供应商获取样片评估。

若需要,我可以根据具体输入电压、目标输出电压与允许纹波/效率目标,帮您计算推荐电感与电容规格并给出一份简单的参考原理图元器件清单。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.