Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RICHTEK RT9053AZQW
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RICHTEK RT9053AZQW
- Type
- RICHTEK
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 230mV@(400mA)
- Electronic Component
- RICHTEK
- Electronic Component
- 30uVrms
- Electronic Component
- RT9053AZQW
- Electronic Component
- 1
- Package
- WDFN-6(2x2)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.046g
- Electronic Component
- 1
- Electronic Component
- BM0264536049
- Operating Temperature
- 40℃~+85℃@(Ta)
- Operating Voltage
- 5.5V
- Output
- Electronic Component
- Output Voltage
- 800mV~5.5V
- Output Current
- 400mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RT9053AZQW 产品概述
一、产品简介
RT9053AZQW 是台湾立锜（RICHTEK）推出的一款低压差线性稳压器（LDO），采用 WDFN-6 (2×2) 封装，面向对尺寸、噪声和电源抑制有较高要求的便携与嵌入式系统。器件为正极输出、单通道可调型，支持外部使能控制，集成热关断与过流保护，适合为模拟前端、传感器、无线模块和低功耗微控制器提供稳压电源。
二、主要规格
- 工作电压（Vin）：最高 5.5V
- 输出电压（Vout）：可调 0.8V ~ 5.5V
- 输出电流（Iout）：最高 400mA
- 压降（Dropout）：230mV @ 400mA
- 静态电流（Iq）：35µA（典型）
- 输出噪声：30µVrms
- PSRR：-56dB @ 1kHz，-35dB @ 10kHz
- 工作温度：-40°C ~ +85°C（Ta）
- 封装：WDFN-6 (2×2)
三、功能特点
- 可调输出，外部电阻分压设定所需电压（0.8V 起）
- 低压差设计，在满载 400mA 条件下仅约 230mV 压降，适合低压输入应用
- 低静态电流（35µA）利于电池供电设备的待机节能
- 优良的噪声与 PSRR 性能，适合供电给 ADC、RF 前端等敏感模块
- 内置使能（EN）管脚、热关断与过流保护，提升系统可靠性
四、典型应用
- 便携式设备与电池供电系统
- 传感器供电与数据采集前端（ADC）
- 无线通信模块（Wi‑Fi/BT 子模块稳压）
- 工业与家电中低电压供电子系统
五、设计与布局建议
- 输入与输出电容需接近器件引脚，建议使用低 ESR 的陶瓷电容以保证稳定性与低噪声
- 设置输出电压时，确保反馈分压阻值不过高以避免受噪声影响，同时考虑微安级偏置电流误差
- EN 管脚逻辑电平设计避免噪声误触发，必要时加滤波或上拉/下拉电阻
- 大电流路径应走宽铜且尽量短，器件底部散热焊盘建议与 PCB 大面积地铜连通以利散热
六、封装与散热
WDFN-6 (2×2) 小尺寸有利于空间受限设计，但散热依赖于底部焊盘与 PCB 的热扩散。高平均或瞬时负载时，建议在 PCB 下方与周围布置散热铜箔并使用过孔连接多层地平面以降低温升。
如需详细电气特性曲线、引脚定义及典型应用原理图，请参考 RT9053AZQW 完整数据手册以获取精确设计参数。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
