Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RICHTEK RTQ2104GSP-QA RTQ2104GSP
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RICHTEK RTQ2104GSP-QA
- Type
- RICHTEK
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RICHTEK
- Electronic Component
- RTQ2104GSP-QA
- Electronic Component
- 1
- Package
- SOP-8-EP
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.15g
- Electronic Component
- 1
- Features
- Built-in LDORegulator;;; EMI Optimization
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0257689906
- Operating Temperature
- 40℃~+125℃@(TA)
- Operating Voltage
- 3V~36V
- Switching Frequency
- 2.1MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RTQ2104GSP-QA 产品概述
一、产品简介
RTQ2104GSP-QA 是台湾立锜（RICHTEK）推出的一款高性能降压型 DC-DC 开关稳压器，采用单通道降压拓扑并内置功率开关，封装为 SOP-8-EP。芯片支持宽输入电压 3V ~ 36V，输出电压可调范围 0.8V ~ 36V，最大输出电流可达 3A，开关频率高达 2.1MHz，工作温度范围 -40℃ ~ +125℃（TA）。芯片具备同步整流功能并具有超低静态电流（Iq ≈ 40µA），适合对效率、尺寸和休眠功耗有严格要求的电源设计。
二、主要特点
- 宽输入电压范围：3V~36V，适配多种电源环境。
- 可调输出：0.8V~36V，可通过外部分压电阻灵活设定输出电平。
- 高输出能力：3A 连续输出，满足中功率负载需求。
- 高频开关：2.1MHz，利于减小电感和电容体积，降低整体方案体积。
- 同步整流：提高转换效率，尤其在中高负载时表现优异。
- 低静态电流：40µA，有利于电池供电系统的待机寿命延长。
- 内置开关管：简化布局与器件选型，降低系统复杂度。
- 工业级温度范围：-40℃ ~ +125℃，适用于多种恶劣环境。
三、典型应用
- 工业控制与自动化设备的本地电源模块。
- 电信与网络设备的直流降压供电。
- 电池供电设备与便携式终端（关注待机功耗）。
- 汽车电子与车载配件（需结合系统认证与过压保护设计）。
- 嵌入式系统、单板电源管理。
四、设计与布局要点
- 输入旁路电容应靠近芯片 VIN 引脚铺设，优先选择低 ESR 陶瓷电容以抑制纹波与尖峰。
- 输出端采用多层陶瓷电容与必要的后置滤波，保障稳定性与瞬态响应。
- 热沉焊盘（EP）必须与 PCB 大面积接地相连，以提高散热与降低热阻。
- 高频布线注意环路面积最小化，开关节点走线短且远离敏感信号。
- 根据输出电压选择合适的电感与电容，确保环路稳定与瞬态性能。
- 在高压或汽车场景下，补充输入浪涌保护与过压/欠压保护电路。
五、包装与可靠性
RTQ2104GSP-QA 采用 SOP-8-EP 封装，既便于手工焊接，又利于散热与自动化生产。器件由立锜出品，适用于追求尺寸、效率与低待机功耗平衡的电源方案。设计时应结合系统整体规范，完成必要的热仿真与电磁兼容测试以确保可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
