Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RICHTEK RT6258CGQUF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RICHTEK RT6258CGQUF
- Type
- RICHTEK
- Minimum package
- 1500
Technical parameters
- Electronic Component
- RICHTEK
- Electronic Component
- RT6258CGQUF
- Electronic Component
- 1
- Package
- UQFN-12-HL(3x3)
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.121g
- Electronic Component
- 1
- Features
- Built-in LDORegulator;;; Output
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0264981835
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 5.1V~23V
- Switching Frequency
- 750kHz
- Electronic Component
- Electronic Component
- Output Voltage
- 5.1V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RT6258CGQUF 产品概述
一、产品简介
RT6258CGQUF 是 RICHTEK（台湾立锜）推出的一款高集成度降压型 DC-DC 转换器，固定输出 5.1V，最大输出电流 8A，输入电压范围宽（5.1V 至 23V），工作频率 750kHz。芯片内置功率开关与同步整流，采用 UQFN-12-HL (3×3mm) 紧凑封装，适合空间受限且需高效率、大电流的点-of-load 应用。
二、主要规格
- 功能类型：降压型（Buck）
- 输入电压：5.1V ~ 23V
- 输出电压：固定 5.1V
- 输出电流：最大 8A
- 开关频率：750kHz（典型）
- 静态电流（Iq）：约 100μA
- 工作结温（TJ）：-40°C ~ +125°C
- 同步整流：是（内置同步 MOSFET）
- 封装：UQFN-12-HL (3×3)
三、关键特性
- 内置高侧/低侧开关与同步整流，降低外部器件数并提高转换效率；
- 750kHz 开关频率，有利于使用体积更小的电感与滤波电容；
- 轻载高效模式，实现轻负载时的低功耗运行（静态电流 ~100μA）；
- 内置 LDO 稳压器，用于为控制电路或外部偏置提供参考电源；
- 逐波（cycle-by-cycle）限流与过流保护；输出放电功能可在关闭时快速释放输出电荷；
- 工作状态指示与保护锁死机制，在严重故障时保持锁定以防止重复损伤。
四、典型应用场景
适用于需要稳定 5.1V 输出且对效率、热性能有要求的领域，例如通信设备、工业控制、网络设备、嵌入式系统与分布式电源点负载（point-of-load）。
五、封装与热设计建议
UQFN-12-HL (3×3mm) 小型化封装利于紧凑布局，但热阻相对较高。建议在 PCB 设计中：
- 在裸露底盘（EP）下方铺大面积散热铜箔并多通孔过孔下沉热量；
- 输入侧短路径布局，尽量缩短信号与电感环路长度以降低 EMI；
- 输出旁配备低 ESR 陶瓷电容以保证瞬态响应。
六、设计注意事项与保护行为
- 选择适配电感与输出电容时应兼顾电流承载能力与饱和电流余量，750kHz 使电感值可选较小，但注意峰值电流与热耗。
- 输出放电功能在关断后迅速将输出拉低，便于上电序列与系统复位。
- 在发生严重过流或故障时芯片具备保护锁死功能，可能需外部复位或断电重启来恢复工作（设计时应考虑恢复策略）。
- 轻载高效模式下效率提升明显，但在噪声敏感应用需评估开关行为对系统的影响。
七、快速选型建议
若需在 12V 或 24V 总线为局部模块提供稳定 5.1V/8A 输出，且要求器件小型化、效率高、具备多重保护，RT6258CGQUF 为合适选择。最终器选型时，请参考 RICHTEK 官方数据手册获取详细引脚定义、典型电路与完整电气特性，并进行热仿真与实物验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
