WMSIC Electronic Components

RICHTEK RTQ2822WGQVF

ModelRTQ2822WGQVF
PackageVQFN-18L_3.5x3.5
BrandRICHTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RICHTEK RTQ2822WGQVF
Type
RICHTEK
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RICHTEK
Electronic Component
RTQ2822WGQVF
Electronic Component
1
Package
VQFN-18L_3.5x3.5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.106g
Electronic Component
1
Features
Built-in LDORegulator;;;; Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265370064
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~17V
Switching Frequency
400kHz;1.2MHz;800kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTQ2822WGQVF 降压型DC-DC转换器产品概述

RTQ2822WGQVF是台湾立锜(RICHTEK)推出的一款同步降压型DC-DC转换器,专为中高功率、宽电压范围的电子系统设计,集成高低侧MOSFET,具备高效能、小体积、宽温适应等核心优势,可满足工业控制、通信设备、车载电子等多场景的供电需求。

一、核心拓扑与功能定位

该芯片采用降压式拓扑结构,通过同步整流技术替代传统异步整流的续流二极管,显著降低导通损耗;内置高低侧功率MOSFET,无需外置开关管,既简化电路设计,又减少BOM成本与PCB占用空间,适合对体积和成本敏感的紧凑系统。其功能定位清晰:为需要12A持续输出电流、宽输入/输出电压范围的负载提供稳定高效的直流供电,覆盖从低功耗待机到高负载运行的全场景需求。

二、关键电气性能参数

RTQ2822WGQVF的电气参数覆盖范围广,适配性强:

  • 输入电压范围:4.5V~17V,兼容单节锂电池(3.7V/4.2V)、双节锂电池(7.4V/8.4V)、12V工业电源等常见供电来源;
  • 输出电压范围:600mV~5.5V,支持外部电阻分压可调,可灵活匹配CPU、FPGA、传感器、功率芯片等不同负载的电压需求;
  • 输出电流能力:12A持续输出,内置MOSFET可承载高电流,无需额外外置开关管,避免功率损耗与散热问题;
  • 开关频率:提供400kHz、800kHz、1.2MHz三档可选,可根据系统需求优化:低频率(400kHz)适合大电感设计,降低EMI干扰;高频率(1.2MHz)适合小体积电感,适配紧凑PCB布局;
  • 静态电流:仅600uA,低待机功耗可延长电池供电设备的续航时间,同时满足系统待机时的低功耗要求;
  • 工作温度范围:结温(TJ)支持-40℃~+125℃,覆盖工业级与部分车载级环境,可在极端温度下稳定工作。

三、同步整流与内置MOSFET的优势

同步整流是RTQ2822WGQVF的核心优势之一:相比异步整流(续流二极管),其采用低导通电阻的MOSFET作为续流管,在低输出电压(如600mV)场景下,导通损耗可降低70%以上,效率提升至90%+(典型值)。同时,内置高低侧MOSFET:

  • 减少外部元件数量(无需外置开关管、续流二极管),降低BOM成本约15%~20%;
  • 缩小PCB面积(3.5x3.5mm封装+集成MOSFET),适合高密度设计;
  • 提高电路可靠性,避免外部元件焊接不良、参数漂移等问题。

四、封装与散热设计

该芯片采用VQFN-18L_3.5x3.5mm封装,属于小尺寸高密度封装:

  • 引脚布局优化,焊盘与PCB连接紧密,散热路径短,可有效导出12A输出时的功率损耗(典型效率92%,损耗约1W);
  • 无外露引脚,抗干扰能力强,适配EMI要求严格的通信/工业场景;
  • 封装厚度薄(约0.8mm),适合超薄设备(如便携终端、车载中控)的设计需求。

五、典型应用场景

RTQ2822WGQVF的参数特性使其适配多领域应用:

  • 工业控制:PLC模块、伺服驱动器、传感器节点(宽温、12A高电流);
  • 通信设备:基站射频单元、路由器核心板、交换机电源(12V输入、5V/3.3V输出);
  • 车载电子:车载中控、仪表盘、ADAS传感器(宽输入电压、-40℃~+125℃宽温);
  • 消费电子:高性能笔记本、游戏主机(12A输出给CPU/GPU,低静态电流待机)。

六、设计灵活性与可靠性

除核心参数外,该芯片的设计灵活性突出:

  • 输出电压可调:通过调整反馈电阻的分压比,可快速配置0.6V~5.5V的任意输出电压;
  • 开关频率可调:可根据电感尺寸、EMI测试结果选择最优频率,平衡体积与电磁兼容性;
  • 宽温可靠性:结温范围覆盖工业级环境,无需额外散热片即可稳定工作(合理PCB散热设计下)。

总结

RTQ2822WGQVF凭借宽输入输出范围、12A高输出电流、同步整流高效、小尺寸封装、宽温适应等核心优势,成为中高功率降压应用的优选方案,可有效简化系统设计、降低成本、提升可靠性,适配工业、通信、车载等多领域的紧凑供电需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.