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ROQANG RVT1E331M0810
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROQANG RVT1E331M0810
- Type
- SMD, 8X10.2MM
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROQANG
- Electronic Component
- RVT1E331M0810
- Electronic Component
- 1
- Electronic Component
- 330uF
- Package
- SMD,8x10.2mm
- Electronic Component
- SMD Aluminum Electrolytic Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 1.246g
- Electronic Component
- 1
- Electronic Component
- BM0264793503
- Electronic Component
- 2000hrs@105℃
- Operating Temperature
- 40℃~+105℃
- Current
- 228mA@120Hz
- Voltage
- 25V
- Capacitor
- 8mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RVT1E331M0810 产品概述
一、产品概要
RVT1E331M0810 是 ROQANG（容强）出品的一款贴片型铝电解电容，标称容量 330μF，公差 ±20%，额定电压 25V。封装为 SMD，电容体直径 8mm，长度 10.2mm（D8×L10.2mm），适合高密度贴片电路板的滤波与能量缓冲应用。
二、主要规格
- 容量：330μF ±20%
- 额定电压：25V
- 纹波电流：228mA @ 120Hz（测试基准为 120Hz）
- 封装尺寸：φ8mm × L10.2mm（SMD）
- 工作温度：-40℃ ~ +105℃
- 使用寿命：2000 小时 @ 105℃
- 品牌：ROQANG（容强）
- 型号：RVT1E331M0810
三、性能与特性
- 高频去耦与低频滤波兼顾：较大容量在低频滤波、输出滤波与能量储存方面效果显著；在开关电源输出端可配合固态电容改善瞬态响应。
- 温度与寿命：标注 2000 小时 @ 105℃的寿命指标，适用于工业级温度要求的场合，但对于需要更长寿命或汽车级认证的场景需额外评估。
- 极性元件：铝电解电容为极性器件，使用时必须保证极性正确并避免反向电压。
- 纹波与热管理：纹波电流会导致电容自发热，长期超出额定纹波会加速性能衰减，应关注电路中实际纹波幅值与频率对容器发热的影响。
四、典型应用
- 开关电源输出滤波、整流后平滑电容
- 模拟电源去耦与电压稳压模块的储能元件
- 工业与消费类电子设备的电源滤波、功率管理模块
- 需要中等容量、贴片化封装的紧凑型电源设计
五、可靠性与使用建议
- 降额使用：为延长寿命，建议在实际设计中对额定电压进行降额（例如在 60%~80% 额定电压范围内长期使用），并尽量降低工作温度。
- 控制纹波：确保实际工况下的纹波电流不超过器件允许值，必要时增加并联电容或采用更高纹波能力的型号。
- 温度影响：低温下电容容值会下降且 ESR 增大；高温会加速性能老化，设计时需评估温度对系统性能的影响。
- 储存与装配：避免长期在高温高湿环境下储存；贴片后应按推荐回流曲线进行焊接，避免超温或超时。
六、封装与焊接注意事项
- 封装形式为 SMD，建议按厂商推荐的 PCB 贴片焊盘与丝印定位。
- 回流焊接应参考 ROQANG 的焊接工艺说明，使用符合无铅回流规范的温度曲线以保证焊点可靠性。
- 焊接后建议进行外观与电性能抽检，关注漏电流、容值与 ESR 的变化。
七、订购信息
- 型号：RVT1E331M0810
- 品牌：ROQANG（容强）
在选型与批量采购前，请与供应商索取完整数据手册与可靠性报告，以便进行热分析、老化试验与最终通板验证。
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