WMSIC Electronic Components

ROQANG VT1E471M1010

ModelVT1E471M1010
PackageSMD,10x10.2mm
BrandROQANG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROQANG VT1E471M1010
Type
SMD, 10X10.2MM
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROQANG
Electronic Component
VT1E471M1010
Electronic Component
1
Electronic Component
470uF
Package
SMD,10x10.2mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
1.55g
Electronic Component
1
Electronic Component
BM0264860469
Electronic Component
2000hrs@105℃
Operating Temperature
40℃~+105℃
Current
286mA@120Hz
Voltage
25V
Capacitor
10mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VT1E471M1010 产品概述

一、产品简介

VT1E471M1010 为 ROQANG(容强)系列贴片型铝电解电容,标称容量 470 µF,额定电压 25 V,容量公差 ±20%。该器件采用 SMD 封装,电容体直径 10 mm,长度 10.2 mm(D10×L10.2mm),体积小、厚度低,适合空间受限的表面贴装电路板应用。额定纹波电流为 286 mA(120 Hz),适用于中低功率电源滤波与去耦场合。

二、主要性能参数

  • 容值:470 µF(±20%)
  • 额定电压:25 V
  • 纹波电流:286 mA @ 120 Hz
  • 封装尺寸:Φ10.0 mm × L10.2 mm(SMD)
  • 工作温度范围:-40 ℃ 至 +105 ℃
  • 工作寿命:2000 小时 @ 105 ℃
  • 品牌:ROQANG(容强)
  • 封装类型:贴片(SMD)

三、产品特点

  • 紧凑小型:D10×L10.2mm 的小体积设计,便于高密度 PCB 布局和自动贴装生产。
  • 中高温耐受:额定最高工作温度可达 105 ℃,并通过 2000 小时高温寿命设计,适合工业级环境使用。
  • 可靠去耦能力:470 µF 的大容量结合适度纹波电流,能有效平滑输出、电源启动和短时负载波动。
  • 适应性强:宽工作温度范围和标准的 SMD 封装,方便在多种电子产品中替换与应用。

四、典型应用场景

  • 开关电源输出滤波与稳压电路
  • DC-DC 转换模块与电源总线去耦
  • 工业控制与通信设备的电源滤波
  • LED 驱动与消费类电子设备(空间受限处)
    (在高温或连续高纹波环境,应根据散热条件和寿命要求做进一步评估)

五、安装与使用建议

  • 回流焊工艺:建议按照厂家推荐的回流温度曲线进行焊接,避免超温或多次暴露在高温下以免影响寿命。
  • 焊盘与贴装:采用符合器件尺寸的焊盘设计,保证良好焊点并减少机械应力;贴装时避免过大弯曲或挤压。
  • 电压与纹波管理:为了延长使用寿命,实际应用中建议留有一定电压裕度(例如优先考虑保留约 10%~30% 的电压余量),并确保实际流经的纹波电流不超过额定值,必要时考虑并联电容或增加散热。
  • 清洗与可靠性:使用温和的清洗剂并避免强酸碱性溶剂,清洗后充分干燥;长期存放应保持干燥并避免潮湿环境。

六、可靠性与寿命提示

  • 额定寿命:2000 小时 @ 105 ℃。实际使用寿命会随着工作温度下降显著延长;在常见的 85 ℃ 或室温条件下,寿命可得到显著提升(具体寿命与使用条件有关,建议在关键应用中进行加速寿命试验评估)。
  • 热与纹波影响:高纹波电流会导致电容自热,长期高纹波下会缩短寿命;合理的热管理与布局有助于维持稳定性能。
  • 性能退化:电解质类电容随时间会出现容量下降和漏电流增大,应在关键电源回路中考虑老化余量和定期检测方案。

七、包装与选型建议

  • 封装:SMD(贴片),便于自动化贴装与回流焊接。
  • 选型:在选择时结合电路最大工作电压、纹波电流、允许工作温度及寿命要求;遇到高纹波或更长寿命需求,可考虑更大体积或更高规格的型号。
  • 订购与替代:订购时请以完整型号与规格为准,若需大批量使用或做替代,请获取厂家完整数据手册以确认焊接曲线、机械尺寸和可靠性试验报告。

总结:VT1E471M1010 是一款面向中等功率滤波与去耦应用的紧凑型 SMD 铝电解电容,具有不错的容量密度和耐高温设计,在工业和消费电子的空间受限场合具有良好适配性。使用时应关注纹波电流、散热与适当降额,以保证长期可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.