WMSIC Electronic Components

R+O BSS84 P-Channel MOSFET BSS84

ModelBSS84
PackageSOT-23
BrandR+O
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
R+O BSS84
Type
R+O
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
R+O
Electronic Component
BSS84
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0265136786
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
680mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS84(R+O 宏嘉诚)P沟道MOSFET 产品概述

一、产品简介

BSS84 为一款小封装(SOT-23)的P沟道场效应晶体管,适用于低功耗、小电流的高侧开关与切换应用。该器件由 R+O(宏嘉诚)出品,具有60V的漏源耐压和小体积封装,便于在便携式电源管理、电池保护和信号切换电路中使用。

二、主要电气参数(核心规格)

  • 数量:单只 P沟道
  • 漏源电压 Vdss:60 V
  • 连续漏极电流 Id:170 mA(额定)
  • 导通电阻 RDS(on):3.3 Ω @ Vgs = 10 V;3.5 Ω @ Vgs = 4.5 V
  • 功耗 Pd:680 mW(封装限制)
  • 阈值电压 Vgs(th):约 1.4 V(以绝对值计;P沟道器件在工作时通常以负栅源电压开通)
  • 总栅极电荷 Qg:1.77 nC @ 10 V
  • 输入电容 Ciss:43 pF
  • 输出电容 Coss:2.9 pF
  • 反向传输电容 Crss:2.8 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23

三、特性与优点

  • 高电压耐受:60V 的 Vdss 使其能胜任较高电压的高侧开关与保护场合。
  • 小体积封装:SOT-23 便于在空间受限的电路板上布局,适合消费类电子与便携设备。
  • 低栅电荷与小输入电容:Qg = 1.77 nC、Ciss = 43 pF,有利于较快的开关响应和较低的驱动能耗,适合频繁开关的低功率场景。
  • 容易驱动:在常见的逻辑电平(如单电池、多电池管理)下,可通过简单的驱动电路实现开关控制。
  • 宽温度范围:-55℃至+150℃,适合工业级环境。

四、典型应用场景

  • 电池或电源的高侧开关(小电流负载)
  • 便携设备的电源管理与电源路径控制
  • 反向极性保护与短路检测电路(与限流方案配合)
  • 信号切换与模拟开关应用(低频、低电流)
  • 小功率负载(LED指示、传感器供电等)

五、使用建议与注意事项

  • 注意极性:作为P沟道器件,栅源电压应相对于源极为负才能导通(即 Vgs 为负值),在设计驱动时要考虑电源与逻辑电平的相对关系。
  • 功耗与散热:SOT-23 封装的 Pd = 680 mW 是在特定条件下的最大耗散,实际应用中需评估结温上升并通过足够的铜箔散热或降低导通电流来控制功耗。高 RDS(on)(几欧姆量级)意味着在较大电流下会产生明显的压降与热量,不适合大电流应用。
  • 开关性能:较低的 Qg 与 Ciss 有利于驱动效率,但若在高频率或大电容驱动场景下,仍需注意驱动器能力与谐振问题。
  • 极限参数:在选型与电路保护设计中,严格不要超过 Vdss、Id 和允许结温等额定值;若需反向恢复或抗浪涌能力的详细数据,应参阅完整数据手册或联系厂商确认。
  • 测试与布局:在PCB布局上尽量缩短栅极到驱动源的回路,提供合理的源/漏热沉铜区,并在需要时加上栅极电阻以抑制振铃与限流。

六、典型电路建议

  • 高侧开关(单电池供电):将源接电源正极,漏接负载,栅极通过驱动器拉至接近源电位以关断;拉至低于源一定电压(注意绝对值与安全范围)以导通。对快速开关场合可在栅极串联小电阻(几十欧姆)抑制振荡。
  • 作为反向连接检测/保护器件时,可与整流或比较电路配合,利用其单向导通特性实现简单保护功能。

七、选型结论

BSS84(R+O 宏嘉诚)适合小电流、高压耐受且空间受限的高侧开关与低功耗切换场合。若应用中工作电流接近或超过数百毫安,或需极低导通损耗,应考虑RDS(on)更低、封装散热能力更强的替代器件;反之,在 170 mA 以内、对体积和成本敏感的场合,BSS84 是一个实用且成本友好的选择。

如需我帮忙生成典型原理图连接示意或进行热分析与参数计算,请提供具体工作电压与负载电流,我可以进一步给出更精确的设计建议。

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