WMSIC Electronic Components

ST TL084IDT Quad Operational Amplifier TL084IDT

ModelTL084IDT
PackageSOIC-14
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) TL084IDT
Type
ST
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
TL084IDT
Electronic Component
1
Package
SOIC-14
Electronic Component
FET-Input Op Amp
Electronic Component
0.263g
Electronic Component
1
Features
Built-in
Electronic Component
BM0000284370
Operating Temperature
40℃~+105℃
Amplifier
Electronic Component
Output Current
40mA
(SR)
16V/us
Power Supply Voltage
6V~36V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TL084IDT 产品概述

TL084IDT 是一种高性能的四路J-FET输入运算放大器,由意法半导体(STMicroelectronics)生产。其设计目标是为需要低噪声、低失真以及宽带宽的应用,提供卓越的放大性能。该器件适合多种工业和消费电子应用,如信号处理、音频放大、传感器信号调理和数据采集系统等。

基本参数和特性

TL084IDT 的核心特性包括:

  • 增益带宽积(GBP): 4MHz
  • 压摆率(SR): 16V/µs
  • 输入偏置电流: 20pA
  • 输入补偿电压: 3mV
  • 单通道耗电: 1.4mA
  • 最大输出电流/通道: 40mA

这些参数让 TL084IDT 在许多应用场景中都表现出色,特别是在需要高增益和宽频带的配置中。

电源和工作条件

TL084IDT 支持单电源和双电源供电,供电电压范围为:

  • 单电源: 6V ~ 36V
  • 双电源: ±3V ~ ±18V

这种灵活的电源配置使其适合多种电源环境,能够满足不同系统的需求。同时,此器件具有宽广的工作温度范围,从-40°C到105°C,保证其在恶劣环境下的稳定性和可靠性。

封装和安装类型

TL084IDT 采用了14引脚的SOIC(Small Outline Integrated Circuit)封装,尺寸为0.154英寸宽(3.90mm),非常适合表面贴装。这种封装形式不仅有助于节省电路板空间,还提供良好的散热性能,对于高集成度的现代电子设备尤为重要。

应用场景

由于其性能卓越,TL084IDT主要应用于以下几类场景:

  1. 音频设备: 其低噪声特性和良好的线性度使其在音频放大器和混音器中发挥重要作用,确保音频信号的清晰和真实。

  2. 传感器信号调理: 在与传感器连接的应用中,TL084IDT可以用于信号放大,改善信号的可读性和可靠性。

  3. 数据采集系统: 在高速数据采集系统中,其高增益以及快速响应能力保证了实时数据处理的需求。

  4. 仪器仪表: TL084IDT 在各种测量和监视仪器中尤其重要,通过高精度放大信号,提高仪器的测量能力。

总结

TL084IDT 运算放大器以其卓越的技术参数和广泛的应用适用性,成为电子设计中重要的组成部分。凭借意法半导体的技术支持和制造经验,TL084IDT 提供了高性能与高可靠性的完美结合,适用于各种工业与消费电子应用。对于设计工程师而言,其灵活的电源要求和卓越的放大性能,使得 TL084IDT 成为建设高效能电子系统的理想选择。无论是在需要极低噪声、宽带宽的场合,还是在要求高线性度和低失真的配置,TL084IDT 的特性均能满足设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.