Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM324DT 是意法半导体(STMicroelectronics)推出的一款四通道运算放大器,适用于各种应用场景。其设计以高性能、低功耗和广泛的工作电压范围为导向,广泛应用于信号处理、传感器接口、音频放大以及其他需要信号放大的电子电路中。
增益带宽积(GBP): LM324DT 的增益带宽积为1.3MHz,意味着运算放大器在增益和频率之间有良好的折中,适合中等频率的信号放大。
通道数量: 该器件具有4个独立的运算放大器,使其在需要多通道信号处理的应用中显得尤为灵活。多个通道可以实现信号的同时处理,极大提高设计的效率。
功耗: 每个通道的功耗为1.5mA,这使得LM324DT 在电池供电系统中表现出色。低功耗特性非常适合便携式设备和需要延长电池使用寿命的应用。
压摆率(SR): 压摆率为0.4V/µs,适合低速信号放大。尽管它不适用于高速应用,但在大多数通用信号处理任务中表现优秀。
输入偏置电流: 输入偏置电流为20nA,使得LM324DT 在高阻抗信号源的应用中非常合适,能够有效减少信号失真和误差。
电源电压范围: 支持单电源供电(3V ~ 32V)或双电源供电(±1.5V ~ 16V),提供了设计上的灵活性,能够在多种电源条件下工作。
工作温度范围: LM324DT 可在0°C ~ 70°C的环境温度下稳定工作,适合一般工业和消费电子产品的应用。
封装类型: 标准的14-SOIC(0.154",3.90mm宽)表面贴装封装,有助于提高电路板的集成度和焊接方便性。
LM324DT 运算放大器因其强大的性能和灵活的电源配置,适合以下几种应用领域:
ST LM324DT 运算放大器以其优良的参数和可靠的性能,成为电子设计中必不可少的基本元件之一。其多通道设计、低功耗特性以及宽广的电源电压适应能力,使其在众多电子应用中都能游刃有余。因此,无论在工业自动化、消费电子还是医疗设备的设计中,LM324DT 都是一个极具吸引力的选择。其简便的使用和高度的可靠性,使工程师们能够轻松实现复杂的信号处理任务,从而提高产品的整体性能与质量。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products