WMSIC Electronic Components

(10 Pcs) MJD122T4 MJD127 TO-252-2(DPAK)

ModelMJD122T4
PackageTO-252-2(DPAK)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
2 options
Configuration MJD127 · CNY · MJD127 · BM0224107860 · 10 · 3787453 · 0.8284

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) MJD122T4
Type
TO-252-2(DPAK)
Unit
Pcs
Minimum package
10 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
MJD122T4
Electronic Component
1
Package
TO-252-2(DPAK)
Type
NPN
Electronic Component
Darlington Transistor
Electronic Component
0.475g
Electronic Component
1
Electronic Component
BM0000288056
Power Dissipation(Pd)
20W
Electronic Component
Electronic Component
Electronic Component
2500
Collector Current(Ic)
8A
Current (h FE)
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MJD122T4 产品概述

产品简介

MJD122T4 是一款高效能的 NPN 达林顿晶体管,广泛应用于各种高功率和高电流的电子电路当中。作为意法半导体(STMicroelectronics)生产的一款先进器件,MJD122T4 结合了优异的性能和可靠性,可以在高达 150°C 的工作温度下保持稳定工作,适应严苛的环境条件。

主要特点

  • 额定功率: MJD122T4 可承受的最大功率为 20W,使其适合用于高功率应用场景。
  • 集电极电流: 最大集电极电流为 8A,这使得该晶体管非常适合于电机控制、继电器驱动以及其他高电流负载的应用。
  • 集射极击穿电压: 达到 100V 的高电压工作能力,可以有效地满足多种电源应用的需求。
  • Vce 饱和压降: 在 80mA 和 8A 测试条件下,Vce 饱和压降最大值为 4V,显示出晶体管在高负载下的低功耗特性,从而提高了整体效率。
  • DC 电流增益: 在 4A 的集电极电流和 4V 的饱和压降条件下,MJD122T4 实现了最低 1000 的 DC 电流增益,这对于需要高增益的放大器和开关电路显得尤为重要。

应用领域

MJD122T4 的设计使其适用于广泛的应用领域,包括但不限于:

  • 电源管理: 能够在开关电源和线性电源中用作功率开关,改善电源效率。
  • 电机控制: 在电机驱动电路中,MJD122T4 可用于控制直流电机及步进电机,提供精确的功率与速度调节。
  • 音频放大器: 作为音频功率放大器中的输出级,MJD122T4 提供高功率输出并保持良好的线性性能。
  • 继电器驱动: 可用作继电器的驱动器,适应需要较高电流的场景。

封装与安装

MJD122T4 采用 DPAK(TO-252-3)封装,设计为表面贴装型,便于自动化安装和空间限制的设计需求。其 compact 尺寸使其易于在高密度的电路板上布置,同时确保散热效果良好。

工作环境与可靠性

这款达林顿晶体管设计用于高温环境,工作温度可达 150°C,适合于工业及汽车等苛刻环境。低截止电流的特性(最大 10µA)确保在开关状态下的低功耗,从而提升整体系统的能效。

结论

MJD122T4 作为一款性能卓越的 NPN 达林顿晶体管,通过高集电极电流、低饱和压降和高电流增益特性,为各种高功率和电机控制应用提供了可靠的解决方案。无论是用于电源管理,还是高功率放大器,MJD122T4 都是设计工程师的理想选择,将助力实现高效、可靠和经济的电子产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.