Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST TL062IDT Dual Operational Amplifier TL062IDT
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) TL062IDT
- Type
- ST
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- TL062IDT
- Electronic Component
- 1
- Package
- SO-8
- Electronic Component
- FET-Input Op Amp
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Features
- Built-in
- Electronic Component
- BM69419315
- Operating Temperature
- 40℃~+105℃
- Amplifier
- Electronic Component
- (SR)
- 3.5V/us
- Power Supply Voltage
- 6V~36V
- Static Current(Iq)
- 200uA
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TL062IDT 产品概述
概述
TL062IDT是一种高性能的J-FET输入运算放大器，设计用于广泛的模拟信号处理应用。其低噪声特性和高输入阻抗使其成为各种高精密度信号处理系统的理想选择。产品采用8-SOIC封装，便于表面贴装，适用于现代电子电路的集成需求。
关键特性
放大器类型: TL062IDT采用J-FET输入结构，具有高输入阻抗和低输入偏置电流，适合处理微弱信号。
电路数: 本器件包含两个独立的运算放大器，使其能够实现多个信号通道处理，适合于多路复用和信号组合应用。
压摆率: TL062IDT的压摆率为3.5V/µs，能够满足一般应用对信号跟踪速度的要求，确保信号在频率变化时表现出良好的响应能力。
增益带宽积: 该放大器的增益带宽积为1MHz，使其能够在一定增益条件下支持较高的频率信号处理，适用于需要较宽带宽的应用场合。
输入偏置电流: 输入偏置电流小至30pA，极大减少了信号源的负担，适合高阻抗传感器的直接连接。
输入补偿电压: 输入补偿电压为3mV，确保了输入信号的准确线性放大，减少了信号失真。
电流与供电: TL062IDT的工作电流为200µA，每通道输出电流可达20mA，支持多种应用的功率需求。其供电电压范围宽广，支持单电源供电（6V至36V）或双电源供电（±3V至±18V），提供灵活的使用选项。
工作温度范围: 该设备的工作温度范围为-40°C至105°C，适用于各种工业和消费电子环境，确保在苛刻条件下的稳定性能。
安装类型与封装: TL062IDT采用8-SOIC封装，设计便于表面贴装，具有较小的占板面积，适合高密度电路板的设计。
应用领域
TL062IDT运算放大器可广泛应用于多种电子电路，包括但不限于：
- 传感器信号处理: 利用其高输入阻抗和低偏置电流特性，十分适合与温度传感器、压力传感器等薄信号源的组合使用。
- 音频设备: 在音频放大和处理电路中，以其宽带宽、低失真、高压摆率的特点，适合用于高保真音响系统。
- 测量设备: 适用于精密测量设备中的信号放大需求，确保高准确度的测量结果。
- 数据采集系统: 在数据采集系统中作为信号前端，对模拟信号进行适当放大，保证后续的数字转换过程的有效性。
总结
TL062IDT凭借其卓越的性能参数和设计，成为信号处理领域的一个重要元件。其小型化、低功耗、高效能的特点使其适合于现代电子设计的多种需求。无论是在消费电子、工业控制还是医疗设备中，TL062IDT都展示了其广泛的应用潜力和可靠性。如需在高要求应用中寻找一款表现优异的运放芯片，TL062IDT无疑是一个值得考虑的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
