Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST EMIF06-MSD02N16 EMI Filter EMIF06
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- ST(STMicroelectronics) EMIF06-MSD02N16
- Type
- ST(STMicroelectronics)
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- EMIF06-MSD02N16
- Electronic Component
- 1
- Package
- QFN-16L
- Electronic Component
- EMI Filter (RC, LC Network)
- Electronic Component
- 0.061g
- Electronic Component
- 45Ω
- Electronic Component
- 1
- ESD
- Electronic Component
- Electronic Component
- BM0228594378
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EMIF06-MSD02N16 产品概述
EMIF06-MSD02N16 是意法半导体（ST）面向高速接口和敏感模拟/数字电路的集成 EMI 抑制器件，采用 QFN‑16L 封装，集成 RC/LC 滤波网络与 ESD 保护。器件适用温度范围为 -40℃ 至 +85℃，提供约 45Ω 的阻值特性，用于抑制高频干扰与振铃，提升系统电磁兼容性与抗干扰能力。
一、主要特性
- 集成 EMI 滤波网络（RC/LC 组合），针对差模与共模噪声抑制优化。
- 内置 ESD 保护结构，用于改善接口抗静电放电能力。
- 名义阻值约 45Ω，提供良好的阻尼效果与阻抗匹配能力。
- 工作温度范围：-40℃ ~ +85℃，满足工业级应用需求。
- 封装：QFN‑16L，尺寸紧凑，适合高密度 PCB 布局。
二、典型应用场景
- 各类高速数据接口的前端滤波（例如 USB、HDMI、MIPI 等高速信号线）。
- 射频/无线设备的模拟前端与天线接口电磁兼容优化。
- 汽车电子（非高温车规级）、工控和消费类电子中的 EMI 抑制。
- 电源管理模块与时钟分配网络的噪声隔离。
三、封装与引脚布局
QFN‑16L 封装提供低寄生电感与良好热性能，适合贴片工艺。器件应尽量靠近干扰源或连接器放置，以缩短高频回路长度，提高滤波效率。建议参考 ST 提供的 PCB 封装图与引脚说明以完成布局。
四、设计与布线建议
- 将器件靠近外部接口或噪声源放置，滤波方向应在信号源与敏感器件之间。
- 对地面采用连续接地平面，并在滤波器附近设置短而宽的接地回流路径。
- 保持输入/输出走线最短并对称，避免在滤波器两侧形成较大环路面积。
- 对于高速差分信号，注意差分阻抗匹配，必要时配合差分终端阻抗调整。
- ESD 功能不可替代外部保护时，请在设计中保留焊盘或外部 TVS 的空间。
五、可靠性与热管理
器件适用于工业温度等级，实际系统应考虑 PCB 导热、焊盘散热和长期老化影响。QFN 底部的热沉/接地焊盘可以通过过孔连接至多层地平面以增强散热与 EMC 性能。
六、选型建议与注意事项
在最终选型前，请参阅 ST 官方数据手册确认完整电气特性（如插入损耗、反射、隔离以及 ESD 等级）和引脚定义。针对具体接口速率与阻抗要求，评估 45Ω 阻值是否满足系统阻尼与信号完整性需求。最后确认封装与 PCB 工艺兼容性，完成布局仿真与实验验证。
如需进一步技术参数（频率响应曲线、ESD 等级、典型电路图与参考 PCB 封装），建议直接查阅 ST 官方文档或联系供应商获取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
