Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
STN1HNK60 产品概述
STN1HNK60是一款高性能的N通道MOSFET,具有600V的漏源电压(Vdss)和400mA的连续漏极电流(Id)能力,是用于高压应用的理想选择。该器件由意法半导体(STMicroelectronics)制造,采用SOT-223封装,为表面贴装型组件,方便在高密度电路板上使用。
高电压能力: STN1HNK60的漏源电压为600V,能够在高电压环境中可靠工作,适用于电源转换、驱动电机和其他高压应用领域。
连续漏极电流: 在25°C下,器件能够承受高达400mA的连续漏极电流(Id),这使得它在智能电源管理、LED驱动和其他工业应用中发挥了关键作用。
低导通电阻: 器件在10V驱动下,泄漏源导通电阻(Rds On)为8.5Ω(@500mA),这使得其在开关操作时具有较低的能量损耗,提高了整体效率。
驱动电压: STN1HNK60的栅源极阈值电压(Vgs(th))为3.7V(@250µA),最大栅源电压达到±30V,能够适应多种电路配置,增强了其兼容性。
电气性能: 器件的输入电容(Ciss)达到156pF(@25V),使其在高频应用中能够快速响应,适应高速开关操作。
功率耗散: 该MOSFET的最大功率耗散为3.3W(@25°C),在正常工作条件下可确保稳定运行,避免过热和故障。
广泛的工作温度范围: STN1HNK60设计用于-55°C至150°C的宽工作温度范围,适合各种恶劣环境下的应用,确保其在工业及汽车等领域的可靠性。
STN1HNK60适合多种应用场景,主要包括:
在选择STN1HNK60作为设计元件时,设计师需考虑其热管理、驱动电压和开关频率等因素,以确保最佳性能和可靠性。同时,要确保电路设计能够处理最大功率耗散,以防电路过热引起器件故障。
通过结合其优良的电气特性和广泛的应用场景,STN1HNK60成为现代电子设计中的重要组成部分。不论是在消费电子、工业设备或汽车电子领域,其出色的性能都可以满足严苛的设计需求,助力创新与效率的提升。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products