Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SG2525AP013TR 是一款高性能的 DC-DC 电源转换芯片,专为降压(Buck)和升降压(Buck-Boost)应用而设计。该芯片采用表面贴装型封装(SOIC-16),具有出色的功率转换效率和灵活的输出配置,适用于各种电子设备和嵌入式系统。其工作温度范围为 -25°C 到 +85°C,确保在严苛环境下的稳定性和可靠性。
输出类型与配置:SG2525AP013TR 采用晶体管驱动器输出,提供正的输出配置。这使得它特别适合需要稳定输出电压的应用场景。
拓扑结构:该芯片支持降压和推挽拓扑,能够在不同的电源需求下提供灵活的解决方案。它的降压功能能够有效将输入电压降低到所需水平,而升降压功能则可以在输入电压低于或高于输出电压时维持稳定输出。
频率与占空比:SG2525AP013TR 的开关频率范围为 100Hz 到 400kHz,其最大占空比为 49%。这种高频特性显著减少了电感和电容的体积,提高了电路设计的紧凑性。
同步整流器与时钟同步:该芯片集成同步整流器功能,进一步提高转换效率。此外,它还支持时钟同步,能够与其他系统组件有效配合,降低了电磁干扰(EMI)问题。
控制特性:SG2525AP013TR 提供便捷的控制特性,包括使能和软启动功能。使能功能使用户可以在不需要时关闭供电以节省功耗,而软启动功能则确保输出电压平滑上升,防止输出瞬态过高而损坏负载设备。
电压供电范围:该芯片的供电电压范围为 8V 到 35V,适应性强,可以部署在多种输入电压条件的应用中。
工作温度:其工作温度范围为 -25°C 到 +85°C,延展了其在工业、汽车和消费电子产品中的适用性。
表面贴装型设计:采用标准的 SO-16 封装形式,便于在现代 PCB 设计中集成,适合自动化贴片生产,缩短了产品上市时间。
SG2525AP013TR 广泛应用于以下场合:
SG2525AP013TR 是一款强大的 DC-DC 电源转换器,结合降压和升降压功能,以其优异的性能和可靠性满足各种应用需求。凭借其高开关频率、同步整流及智能控制特性,该芯片为电子产品提供了优化的电源管理解决方案,帮助降低功耗,提升整体效率。无论是在消费电子、工业自动化还是电动汽车等领域,SG2525AP013TR 都能发挥出色的性能,是诸多设计工程师和产品开发者的理想选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products