WMSIC Electronic Components

ST ESDAVLC8-1BM2 ESD Diode ESDAVLC8

ModelESDAVLC8-1BM2
PackageSOD-882
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) ESDAVLC8-1BM2
Type
ST
Minimum package
12000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
ESDAVLC8-1BM2
Electronic Component
1
Package
SOD-882
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
4.5pF
Electronic Component
BM0013068912
Operating Temperature
55℃~+150℃
Voltage
8.5V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ESDAVLC8-1BM2

制造商: STMicroelectronics
系列: ESDA, TRANSIL™
封装类型: SOD-882 (表面贴装型)
状态: 有源元器件
应用: 通用静电放电 (ESD) 保护

一、产品介绍

ESDAVLC8-1BM2 是由意法半导体(STMicroelectronics)推出的一款高性能静电放电(ESD)保护器件,属于其知名的TRANSIL™系列。该器件专为保护敏感电子元件免受静电放电和过压冲击而设计,广泛应用于各种电子设备和电路中。

二、主要参数

  • 电压特性:

    • 反向断态电压(典型值): 3V
    • 击穿电压(最小值): 8.5V
    • 该器件能够在反向电压下稳定工作,并在超过击穿电压的情况下提供必要的保护。
  • 功率与性能:

    • 功率 - 峰值脉冲: 30W
    • 该款器件在脉冲情况下能够承受高达30W的峰值功率,适合高能量的瞬态事件。
  • 电气特性:

    • 电容(在 1MHz 时): 4.5pF
    • 低电容特性使得ESDAVLC8-1BM2适合高频信号线的保护,有助于减少信号失真。
  • 工作温度范围: -55°C 至 150°C

    • 该器件在极端环境条件下仍能保持良好的工作性能,适合广泛的应用场合。

三、应用领域

ESDAVLC8-1BM2 静电放电保护器件广泛应用于以下领域:

  1. 消费电子产品: 如手机、平板电脑、笔记本电脑等便携式设备,这些设备的内部电路对于静电放电异常敏感。
  2. 通讯设备: 支持4G/5G及Wi-Fi等无线通讯的网络设备,能够有效防止信号传输过程中由于静电引起的误码率上升。
  3. 工业设备: 在工业自动化中,设备和传感器也常常会受到静电放电的影响,因此该器件可用于保护工业控制系统。
  4. 汽车电子: 随着电动汽车和智能汽车的发展,车载电子设备的可靠性要求越来越高,ESD保护成为不可或缺的部分。

四、技术特性

  • 双向通道: 该器件具有一个双向通道,适合处理双向信号传输的应用。
  • 表面贴装型封装(SOD-882): 易于自动化焊接的设计符合现代电子制造和组装的需求,提高了生产效率。
  • 环保设计: 符合ROHS标准,材料选择上注重环保,确保在生产和使用过程中不对环境产生负面影响。

五、应用优势

  • 高效的ESD保护: ESDAVLC8-1BM2 能够快速响应静电脉冲,确保保护目标电路免受损坏。
  • 小型封装: SOD-882 封装占用的空间小,能够满足对电路板空间有限制的高密度集成要求。
  • 广泛的工作温度范围: 无论是在极寒的北极还是高温的沙漠,该器件均能正常工作,增强了其应用的灵活性。

总结

总之,ESDAVLC8-1BM2 是一款功能强大、性能稳定的静电放电保护器件,凭借出色的电气特性和行业适应能力,为各种电子设备提供可靠的ESD保护。无论是消费类电子、通讯设备还是工业和汽车领域,该器件均发挥着至关重要的作用,确保电子设备在各种环境中的安全性和可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.