Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST ESDA25P35-1U1M ESD Diode ESDA25P35
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) ESDA25P35-1U1M
- Type
- ST
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- ESDA25P35-1U1M
- Electronic Component
- 1
- Package
- DFN1610-2
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Electronic Component
- BM0000178909
- Operating Temperature
- 55℃~+150℃
- Voltage
- 41V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 200nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：ESDA25P35-1U1M 静电放电（ESD）保护器件
概述
ESDA25P35-1U1M 是由意法半导体（STMicroelectronics）生产的一款高效能静电放电（ESD）保护器件，属齐纳二极管类型，专为各类电子设备提供优越的防护解决方案。该器件特别适用于对抗瞬态电压脉冲以及静电放电事件，确保在高频和高能量情况下的敏感电子元件的安全。
产品特性
电气特性
- 反向断态电压（V_RWM）：典型值为22V，能够有效保护大多数低压设备，确保在正常工作条件下不会发生误触发。
- 击穿电压（V_Br）：最小值为23.3V，确保在必要的情况下能迅速进入保护状态。
- 电压箝位特性：当在特定电流（Ipp）下，最大箝位电压可达到41V，这保证了受保护的设备在遭受瞬态电压时不会被损坏。
电流特性
- 电流 - 峰值脉冲：该器件可以承受高达35A的峰值脉冲（在10/1000µs的波形条件下），以及在8/20µs的条件下也能有效防护，为电路提供卓越的保护性能。
- 功率 - 峰值脉冲：峰值功率可达到1400W（1.4kW），确保其在瞬态事件中能够有效吸收大量能量，保护敏感设备。
工作环境
- 工作温度范围：该器件的工作温度广泛，范围可达到-55°C 到 150°C，适合在极端环境下使用，特别是在工业和汽车等严苛条件下。
- 安装类型与封装：采用表面贴装型（SMD）的封装方式，封装规格为1610（4027公制），便于在现代电子电路中的集成和应用。
应用场景
ESDA25P35-1U1M 适用于各种需求较高的场合，包括但不限于：
- 消费电子产品：如智能手机、平板电脑、以及其他移动设备，防止静电对电路的破坏。
- 工控设备：提供必要的保护，使设备在工业环境中稳定运行。
- 汽车电子：在汽车的电子控制单元（ECU）和传感器中，提高抗干扰能力，防止电压瞬变对系统的影响。
- 通信设备：确保数据传输设备在遭遇瞬态电压干扰时的稳定性，保护信号完整性。
总结
ESDA25P35-1U1M 静电放电保护器件凭借其优异的电气特性和可靠的性能，广泛适用于多种现代电子设备。无论是在消费电子、汽车电子，还是在工业自动化领域，ESDA25P35-1U1M均能提供高效的保护，确保设备的长期可靠运行。选择这一器件，能够为设计师提供更多的设计灵活性和更高的产品安全性，是现代电子设计中一个不可或缺的组件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
