Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M24LR04E-RDW6T/2是一款由意法半导体(STMicroelectronics)推出的高性能RFID应答器,兼具NFC功能,广泛应用于物联网、智能标签及各类无线通讯领域。凭借其卓越的技术规格和多样化的应用场景,该产品为开发者和设计工程师提供了理想的解决方案。
高兼容性: M24LR04E-RDW6T/2支持多种RFID标准与NFC功能,使其在智能标签、支付系统、资产跟踪等领域具备很好的兼容能力,能够满足不同应用的需求。
宽工作电压范围: 本产品可以在1.8V到5.5V的电压范围内正常运行,具备良好的电源适应性,适合多种供电环境,特别是便携式设备的需求。
广泛的工作温度范围: 设计的工作温度范围为-40°C至85°C,使得M24LR04E-RDW6T/2在各种极端环境中均能稳定工作,适用于户外设备及工业场合。
紧凑的封装: 采用8-TSSOP封装,尺寸紧凑,便于在有限空间内集成,适用于小型化设备。例如,智能卡、手持设备等。
快速数据传输: 由于拥有I²C接口,M24LR04E-RDW6T/2可以实现快速的数据交换,适合快速响应的实时应用。
M24LR04E-RDW6T/2的应用领域广泛,主要包括:
M24LR04E-RDW6T/2是一款功能强大且灵活的RFID应答器,结合了多种行业标准,广泛适用于现代智能设备及系统。其出色的性能参数、宽广的应用范围以及符合市场需求的设计,确保了它在诸多领域内的竞争力。
无论是在高温、低温环境下,还是在不同电压和尺寸限制的情形下,M24LR04E-RDW6T/2都能提供稳定的表现,极大地提升了其适用性和可靠性。这使得该产品是您在设计RFID系统时的理想选择。通过优化设计,集成此M24LR04E-RDW6T/2,您将能够充分发挥RFID及NFC技术的优势,推动产品的创新和市场的拓展。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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