WMSIC Electronic Components

ST STFW3N150

ModelSTFW3N150
PackageTO-3PF
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) STFW3N150
Type
ST
Unit
Electronic Component
Minimum package
300 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
STFW3N150
Electronic Component
1
Package
TO-3PF
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
8.093g
Electronic Component
1
Electronic Component
BM0000284105
Operating Temperature
50℃~+150℃
Power Dissipation(Pd)
63W
Electronic Component
Electronic Component
Electronic Component
300

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

STFW3N150 产品概述

一、基本信息

STFW3N150 是一款由意法半导体(STMicroelectronics)制造的高电压,低功耗的N沟道金属氧化物场效应晶体管(MOSFET)。此器件具有出色的电气特性和广泛的应用领域,特别适合高压开关和功率转换电路。它的主要参数包括漏源电压(Vdss)为1500V,连续漏极电流(Id)在25°C时为2.5A,以及最大功率耗散63W。

二、电气特性

  1. 漏源电压(Vdss): STFW3N150 的最大漏源电压达到了1500V,这使其能够在高压应用中工作而不会出现故障,适合用于电力电子设备中。

  2. 连续漏极电流(Id): 在25°C环境温度下,STFW3N150 的连续漏极电流为2.5A,这一特性使其可以承受一定的负载而保持稳定运行。

  3. 栅源极阈值电压(Vgs(th)): 该器件的栅源阈值电压为5V,在250µA的栅源电流下,适用于控制信号电压为5V的电路。

  4. 漏源导通电阻(Rds(on)): 在10V栅源电压和1.3A漏极电流下,漏源导通电阻为9Ω。这一特性对于降低功率损耗和提高转换效率至关重要。

  5. 最大功率耗散: 该组件的热设计功率耗散为63W,确保在高负载情况下也能有效散热。

  6. 驱动电压: STHFW3N150 的最小和最大驱动电压保持在10V,使其能够高效地驱动大多数电路。

  7. 工作温度范围: 它的工作温度可以达到150°C(TJ),适合在高温环境中运行。

  8. 栅极电荷(Qg): 在10V驱动下,栅极电荷为29.3nC。这一低电荷特性有助于降低开关损失,提高开关频率。

  9. 输入电容(Ciss): 在25V下的输入电容为939pF。较小的输入电容使驱动电路设计更为简单。

三、封装和安装

STFW3N150 采用TO-3PF封装,安装类型为通孔,这种设计使得散热性能优越,适合各种电路板。TO-3PF封装为器件提供了良好的机械强度和电气性能,同时也能有效地分散产生的热量。

四、应用领域

STFW3N150 在多个领域具有广泛的应用潜力,尤其是在以下几个方面:

  1. 开关电源: 高压应用中,MOSFET能够在开关过程中保持高效率,降低热量。

  2. 电机驱动: 尤其是在电动车及工业应用中,能够实现高效能的电机控制。

  3. 电源管理: 适用于电源适配器,UPS(不间断电源)和其他电源管理设备。

  4. 高压电器: 在高压电器设备中,能够提供可靠的开关和控制功能。

五、总结

STFW3N150 MOSFET 是一款设计周到、功能强大的器件,具备1500V的高压能力和低导通电阻,使其在高压、高功率应用中表现出色。凭借其优越的电气特性和机械稳定性,STFW3N150 适合用于各种先进的电源应用和电力电子设备。这款产品不仅提高了设计的灵活性和性能,而且有助于降低系统的整体功耗,是当今高效电源设计中的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.