WMSIC Electronic Components

ST ULQ2003D1013TRY

ModelULQ2003D1013TRY
PackageSOIC-16
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) ULQ2003D1013TRY
Type
ST
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
ULQ2003D1013TRY
Electronic Component
1
Package
SOIC-16
Electronic Component
Darlington Transistor Array
Electronic Component
0.284g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0000284004
Operating Temperature
40℃~+105℃
(Vf)
1.7V
Capacitor(Ci)
15pF
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ULQ2003D1013TRY 产品概述

一、产品介绍

ULQ2003D1013TRY 是由意法半导体(STMicroelectronics)生产的一款集成电路,属于表面贴装型的双极结晶体管(BJT)阵列,具备 7 个 NPN 达林顿晶体管。它的工作电压可达 50V,最大集电极电流(Ic)为 500mA,是实现高电流驱动的理想选择。这款器件被广泛应用于电机驱动、继电器控制和灯光控制等场合,能够有效地实现高功率负载的控制。

二、主要特性

  1. 高电流增益:ULQ2003D1013TRY 提供的 DC 电流增益(hFE)在 350mA 和 2V 条件下,最小值可达 1000,显著提高了驱动能力。这样的增益使得即使在较小的基极电流(Ib)情况下,依然能够推动较大的集电极电流(Ic),适用于各种控制电路。

  2. 低饱和压降:在最大集电极电流的工作条件下,Vce 饱和压降最大为 1.6V。这一特性有助于提高电路的效率,降低功率损耗,特别是在需要高频开关的应用中,Vce 的低值可以有效提升系统的性能。

  3. 耐高温性能:ULQ2003D1013TRY 的工作温度达到 150°C,这使得它能够在高温环境下可靠操作,非常适合工业级应用和其它对温度有较高要求的应用。

  4. 高压耐受性:该器件的集射极击穿电压(Vceo(max))达到 50V,能够承受较高的电压,使其适合在多种要求严苛的工作环境中使用。

  5. 紧凑的封装设计:采用 16-SO 封装,具有较小的尺寸和轻便的特性,符合表面贴装的要求,可方便地集成到各种电子设备中。

三、应用领域

ULQ2003D1013TRY 在多个领域展现出广泛的应用潜力,包括但不限于:

  • 电动机驱动:可以用于驱动步进电机和直流电机,有效控制其启停与转速。
  • 继电器和固态继电器:可在自动化控制系统中驱动继电器,实现负载的开关控制。
  • LED 驱动:用于控制灯光、LED 灯阵列等,允许高电流驱动同时保持较低的工作功耗。
  • 工业控制:在装置的驱动和控制电路中,ULQ2003D1013TRY 提供了灵活的节点控制能力,特别是在机器人和自动化生产线的应用中。

四、优势总结

ULQ2003D1013TRY 的优势在于其高集电极电流、高耐压、低饱和压降、强大的电流增益以及极限耐温能力,确保了它在众多高可靠性和高性能要求的应用中的有效性和稳定性。此外,表面贴装型的设计使其能够与现代电子设备中其它器件很好地集成,提高整体的性能和效率。

作为意法半导体的一款核心产品,ULQ2003D1013TRY 不仅满足了当前市场对高效能、高集成度的元器件的需求,同时也为客户提供了极大的设计灵活性和系统优化的可能性。

总结

在设计高效能控制电路时,ULQ2003D1013TRY 是一个值得信赖的选择,凭借其强大的技术参数和多样的应用场景,成为了电子设计工程师在选用驱动和开关电路时的重要工具。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.