WMSIC Electronic Components

ST STM8S003K3T6CTR

ModelSTM8S003K3T6CTR
PackageLQFP-32(7x7)
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) STM8S003K3T6CTR
Type
ST
Unit
Electronic Component
Minimum package
2400 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
STM8S003K3T6CTR
Electronic Component
1
Package
LQFP-32(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.263g
CPU
8 Bit
CPU
STM8
I / O
28
RAM
1KB
Electronic Component
1
ADC
10bit
EEPROM
128Byte
Electronic Component
BM0000284303

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:STM8S003K3T6CTR

STM8S003K3T6CTR 是由意法半导体(STMicroelectronics)推出的一款高性能、低功耗的8位微控制器(MCU),属于 STM8 系列产品。该芯片主要应用于需要简单控制和监测功能的嵌入式系统中,并且由于其灵活性和多功能性,广泛应用于家电、汽车电子、工业控制和物联网(IoT)等领域。

核心处理器和性能

STM8S003K3T6CTR 配备了一颗 8 位核心处理器,主频可达 16MHz。这一特点使得其在多数控制应用中表现出色,保证了在处理简单的计算和逻辑操作时,能够快速响应。该微控制器的完整体系结构和指令集,支持多种编程语言,使其适用于不同的开发环境。

存储器和容量

该芯片拥有 8KB 的闪存(8K x 8),适合存储程序代码,以及 128 x 8 的 EEPROM 用于数据存储,满足一般应用对存储要求。其 RAM 大小为 1K x 8,能够应对多数嵌入式应用的数据存储需求。此外,充足的 EEPROM 容量使得用户能够灵活地存储和更新应用数据。

连接能力

STM8S003K3T6CTR 支持多种通信协议,包括 I²C、IrDA、LINbus、SPI、UART/USART等。这种丰富的连接能力允许该微控制器在复杂的系统中与多个外设进行通信,为实现智能化功能打下了基础。例如,在物联网应用中,通过 SPI 或 UART,可以与传感器、执行器等设备进行实时数据传输和控制。

外设功能

该微控制器具备多种外设功能,包括欠压检测(UVLO)、复位(POR)、脉宽调制(PWM)和看门狗定时器(WDT)。欠压检测确保在供电电压低于正常工作阈值时及时复位,保护整个系统的可靠性。PWM 输出可以用于电机控制和调光应用,配合 WDT 功能,可以增强系统的稳定性和可靠性。

输入/输出引脚

STM8S003K3T6CTR 配备了 28 个 I/O 引脚,能够满足一般控制系统所需的输入和输出要求。这些引脚可以配置为数字输入、数字输出、模拟输入等,适应不同的应用需求。

电压和温度范围

该微控制器的供电电压范围为 2.95V 到 5.5V,便于在不同的供电环境中操作。同时,它的工作温度范围为 -40°C 到 85°C,使其适合在严苛的工业条件和极端环境中应用,保证了其在各种气候条件下的稳定性和可靠性。

封装和尺寸

STM8S003K3T6CTR 采用 32-LQFP(7x7mm)表面贴装封装,这种紧凑的设计使得它能够在空间有限的应用中发挥作用,也便于在现代电路板上进行自动化焊接与组装。

总结

STM8S003K3T6CTR 杰出的性能、灵活的设计以及多种强大的功能,使其成为嵌入式系统中理想的选材。无论是在消费电子、汽车电子,还是在工业自动化、物联网等领域,STM8S003K3T6CTR 都能提供高效的解决方案,为客户的创新设计提供技术支持。其低功耗、高可靠性和丰富的外围接口,进一步促使其在各类应用中的广泛采用。

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