Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST STPS8L30B-TR STPS8L30B
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) STPS8L30B-TR
- Type
- ST
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- STPS8L30B-TR
- Electronic Component
- 1
- Package
- DPAK
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.482g
- Electronic Component
- 1
- Electronic Component
- BM0084330223
- Current
- 8A
- Diode
- 1
- Current(Ir)
- 1mA@30V
- (Vf)
- 490mV@8A
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
STPS8L30B-TR 产品概述
1. 产品简介
STPS8L30B-TR是一款由意法半导体（STMicroelectronics）生产的高性能肖特基二极管，主要用于整流和高频开关电源应用。这款二极管以其卓越的正向压降和快速恢复特性，广泛应用于电源管理、逆变器、DC-DC转换器、电池充电和其他需要高效整流的场合。
2. 关键参数
STPS8L30B-TR二极管的基础参数如下：
- 二极管类型: 肖特基二极管，以其低正向压降和快恢复速度为特点。
- 最大反向电压 (Vr): 30V，确保在高电压环境下的稳定工作。
- 平均整流电流 (Io): 8A，适合需要高电流处理的应用。
- 正向电压降 (Vf): 在8A电流下，正向压降为490mV，渺小的热损耗使其在续流中相当高效。
- 反向泄漏电流: 在30V时为1mA，保证了设备在断开状态下的低功耗。
- 快速恢复特性: 其恢复时间小于500ns，适合高频开关电源。
- 封装类型: TO-252-3（DPAK），便于表面贴装，降低了生产工艺的复杂性。
- 工作温度范围: 结温最高可达到150°C，提升设备的可靠性和稳定性。
3. 应用场景
STPS8L30B-TR因其高效能和高温性能，适用于多种应用，尤其是在对效率、功耗和可靠性有较高要求的领域。具体应用包括：
- 开关电源（SMPS）: 在各种开关电源中，STPS8L30B-TR可用作整流二极管，有助于提高电源转换效率。
- DC-DC 转换器: 在设计DC-DC转换器时，低正向压降的肖特基二极管能够减少能量损失，提升整体效率。
- 电池充电器: 适合用于电池充电设备，有效降低电能损耗，提高充电效率。
- 光伏逆变器: 在光伏发电和逆变应用中，STPS8L30B-TR能够在较高温度和高电流的环境中稳定运行。
- 汽车电子: 其高温工作特性使其适合用于汽车充电和电源管理系统，有助于提升整车的能效。
4. 性能优势
选用STPS8L30B-TR二极管，相比于传统的硅二极管，它的优势在于：
- 低温升: 由于其较低的正向压降，运行时的温升更低，从而提升电路的整体可靠性。
- 高效率: 提升整流效率，尤其是在高频应用中，能够显著减少能量损耗。
- 简化设计: 由于其快速恢复特性，可以减少对额外电路保护和散热的需求，简化整体设计和布局。
5. 结论
STPS8L30B-TR肖特基二极管以其出色的电气特性，为各类高效整流应用提供了理想的解决方案。其广泛的适用性和可靠性，使其成为电源设计工程师在整流和高效能电源管理应用中的首选元件。通过使用STPS8L30B-TR，工程师能够在满足性能需求的同时，最大限度地提高产品的可靠性和效率。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
