WMSIC Electronic Components

ST STF13N60M2

ModelSTF13N60M2
PackageTO-220FPAB-3
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) STF13N60M2
Type
ST
Unit
Electronic Component
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
STF13N60M2
Electronic Component
1
Package
TO-220FPAB-3
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
2.48g
Electronic Component
1
Electronic Component
BM0257640251
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
25W
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

STF13N60M2 产品概述

概述

STF13N60M2 是由意法半导体(STMicroelectronics)生产的一款高性能 N 沟道功率MOSFET,具有杰出的电气特性和广泛的应用潜力。凭借其额定漏源电压(Vdss)为 600V、连续泄漏电流(Id)为 11A 以及较低的漏源导通电阻(Rds(on))为 380 mΩ,这款 MOSFET 在许多高功率和高电压电子电路中表现优异,尤其适合开关电源、马达驱动、电源管理等领域。

主要特点

  1. 高电压和电流能力: STF13N60M2 具备 600V 的额定漏源电压,适用于高电压领域。
  2. 低导通电阻: 在 10V 的栅源电压下,导通电阻最高仅为 380mΩ(在 5.5A 条件下),有效降低开关损耗和热损耗。
  3. 优良的栅极驱动特性: 栅极源极阈值电压(Vgs(th))为 4V(@ 250uA),意味着在较低的驱动电压下,即可实现有效的开关控制。最大栅源电压(Vgs)可达到 ±25V,为设计提供了灵活性。
  4. 散热能力强: 最大功率耗散为 25W(在 Tc=25°C 下),可以有效支持高负载条件下的可靠运行。同时,该器件工作温度范围广泛,从 -55°C 到 150°C,适合各种环境下的应用。
  5. 紧凑封装: TO-220FP 封装有助于有效的热管理,便于散热,同时便于在电子设备中实现高密度布局。

应用场合

STF13N60M2 基于其优秀的电气性能,适合以下应用场合:

  • 开关电源(SMPS): 该MOSFET可以在开关电源中用作主开关器件,以实现高效率能量转换。
  • 电机控制: 对于马达驱动,STF13N60M2 可以作为驱动开关,支持高电压和电流需求的无刷和有刷电机。
  • 电源管理: 在各种电源管理电路中,它可用作开关、逆变器或调节器。
  • 灯光控制: 适用于 LED 驱动和光源调节系统中,以实现高效照明解决方案。

性能与可靠性

STF13N60M2 的设计考虑了性能与可靠性之间的平衡。其低导通电阻和高电压电流额定值使其在高温和高负载条件下运行更加稳定。而宽广的工作温度范围使其可以在各种严酷环境下应用,确保其长期的性能保持。

结语

综上所述,STF13N60M2 是一款高度可靠的 N 沟道MOSFET,适合各种高压和高功率应用。它的低导通电阻、高电压能力/电流能力、良好的热管理特性以及宽广的工作温度范围使其成为许多电子设计工程师的理想选择。不论是在工业、消费电子,还是汽车电子等领域,STF13N60M2 都能发挥出色的性能,为设计者提供强有力的支持和保障。在进行电气设计和选择合适的功率半导体器件时,STF13N60M2 定会成为一个值得信赖的伙伴。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.