Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST SMBJ6.5CA-TR SMBJ6.5CA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ST(STMicroelectronics) SMBJ6.5CA-TR
- Type
- ST
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- SMBJ6.5CA-TR
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.224g
- Electronic Component
- 1
- Electronic Component
- BM0092034022
- Operating Temperature
- 55℃~+150℃
- Voltage
- 14.5V
- Electronic Component
- IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 50uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SMBJ6.5CA-TR
1. 概述
SMBJ6.5CA-TR 是由意法半导体（STMicroelectronics）生产的一款高性能双向齐纳二极管，主要用于静电放电（ESD）和浪涌（TVS）保护。这款器件采用表面贴装型（SMD）封装，符合DO-214AA标准，适合于各种电子设备的电源线和信号线的过压保护。
2. 主要特点
- 齐纳二极管类型：SMBJ6.5CA-TR 作为齐纳二极管，具有稳定的反向击穿电压特性，能够在超过额定电压时有效地进行电压钳位。
- 双向通道：产品设计为双向通道，可以同时在正向和反向两种工作条件下提供保护，适用于交流和直流电源线。
- 反向断态电压：典型值为6.5V，保证在正常工作条件下对电子元件的安全性。
- 击穿电压：该器件的最低击穿电压为7.2V，确保其在遭遇电压冲击时能够迅速落入安全状态，防止电路损坏。
- 峰值脉冲电流：具有高达56A的峰值脉冲电流处理能力，使其在面对高能瞬态事件（如雷电或电源浪涌）时，仍具备良好的保护性能。
- 峰值功率：SMBJ6.5CA-TR 的峰值脉冲功率为600W，能够有效地消耗在瞬态击穿时产生的能量，保护下游电路。
- 工作温度范围：-55°C 到 150°C 的宽温度范围，使其在各种极端环境中保持稳定工作。
3. 应用领域
SMBJ6.5CA-TR 被广泛应用于以下场景：
- 消费电子设备：手机、平板电脑、笔记本电脑等电子产品的接口保护。
- 通讯设备：网络设备、路由器和交换机的信号线和电源线保护。
- 工业自动化：在工控设备中保护传感器和执行器等关键组件。
- 汽车电子：车辆电子系统中的电源和信号保护，确保安全性与可靠性。
- 电源供应器：有效防止因浪涌电压导致的损坏，用于开关电源和适配器保护。
4. 封装和安装
SMBJ6.5CA-TR 采用 SMB（DO-214AA）封装，体积小巧，适合各种表面贴装PCB（印刷电路板）应用。其设计兼容多种自动化焊接工艺，助力提升生产效率。
5. 性能与可靠性
意法半导体在制造过程中实施严格的质量控制，确保每一颗 SMBJ6.5CA-TR 都能在应用过程中实现高可靠性和稳定性。此外，齐纳二极管所提供的电流和温度特性，使其具备良好的热管理性能和长使用寿命。
6. 结论
SMBJ6.5CA-TR 是一款高效、可靠的静电和浪涌保护器件，能够在多种应用场景中，保护敏感电子元件免受高电压冲击的侵害。凭借其卓越的电性能和广泛的适用性，SMBJ6.5CA-TR 是电子产品设计中不可或缺的保护解决方案之一。无论是在消费电子还是工业设备中，均能为用户提供出色的保护效果和极高的性价比，是确保电子设备运营安全的重要保证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
