WMSIC Electronic Components

ST M95M01-DWDW3TP/K M95M01

ModelM95M01-DWDW3TP/K
Package8-TSSOP
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) M95M01-DWDW3TP / K
Type
ST
Minimum package
4000

Technical parameters

Electronic Component
ST(STMicroelectronics)
Electronic Component
M95M01-DWDW3TP/K
Electronic Component
1
Package
8-TSSOP
Electronic Component
EEPROM
Electronic Component
0.147g
Electronic Component
1
Features
Built-in positions(POR);;; Built-in (ECC); Built-in Latch(WEL)
Electronic Component
BM0262122415
Electronic Component
1Mbit
Operating Temperature
40℃~+125℃
Operating Voltage
2.5V~5.5V
Interface Type
SPI
Electronic Component
400
Electronic Component
4000
(Tw)
4ms

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M95M01-DWDW3TP/K(TSSOP-8)产品概述

一、概述

M95M01-DWDW3TP/K 是意法半导体(ST)面向工业级应用的串行 SPI EEPROM,容量 1 Mbit(128 KByte),封装为 8 引脚 TSSOP。器件支持宽电压范围 2.5 V 至 5.5 V,工作温度范围 -40 ℃ 至 +125 ℃,具备极高的数据可靠性与擦写寿命,适合需要长期保存配置信息、日志数据或校准参数的场景。

二、主要性能特点

  • 存储容量:1 Mbit(128 KByte)
  • 接口类型:SPI(标准串行外设接口,兼容常见 SPI 主机)
  • 工作电压:2.5 V ~ 5.5 V,可直接与 3.3 V / 5 V 系统接口
  • 写周期时间(Tw):典型 4 ms(每页/字节写入完成时间)
  • 写周期寿命:高耐久,达 4,000,000 次擦写
  • 数据保持期(TDR):100 年级别的数据保留
  • 工作温度:-40 ℃ ~ +125 ℃(工业级/高温应用适用)
  • 封装:8 引脚 TSSOP(小型化、便于表贴装配)

三、功能与接口说明(典型)

M95M01 为标准 SPI 串行 EEPROM,采用 8 引脚封装,典型引脚功能包含:

  • CS(芯片选择,片选低电平有效)
  • SCLK(串行时钟)
  • SI / MOSI(串行数据输入)
  • SO / MISO(串行数据输出)
  • WP(写保护,外部可控写入保护)
  • HOLD(暂停/挂起串行传输)
  • VCC(电源)
  • GND(地)

(实际引脚命名与功能以厂家数据手册为准,设计时请以官方资料为依据。)

四、可靠性与适用场景

凭借 4,000,000 次的写周期寿命和 100 年的数据保留能力,M95M01 非常适合需要高耐久与长期保存的应用场景,如:

  • 工业控制与自动化设备的配置、校准参数保存
  • 智能电表、传感器节点的历史数据或校准常数存储
  • 医疗与测试仪器的设备标定、序列号与资产管理
  • 消费品或嵌入式产品中的非易失性参数存储与备份

工作温度覆盖 -40 ℃ 至 +125 ℃,使其可用于高温或恶劣环境,提升系统长期可靠性。

五、设计与使用建议

为确保器件稳定运行并延长使用寿命,建议在设计中注意以下要点:

  • 电源与去耦:VCC 旁应放置 0.01 μF 至 0.1 μF 的去耦电容,靠近器件引脚以抑制电源瞬态。
  • 电平匹配:器件支持 2.5 V~5.5 V,系统 I/O 电平需匹配;在混合电压系统中可用电平移位或确保直接兼容。
  • 写入策略:尽量采用批量或页写(若固件支持)减少写周期次数,避免频繁的单字节写入带来的不必要开销与耐久消耗。
  • 写保护与 HOLD:在需要防误写的场合建议使用 WP 引脚并在传输中合理利用 HOLD 控制总线竞争。
  • SPI 时序与片选:确保 SPI 时钟与 CS、数据线时序满足器件要求(参照数据手册),避免在写周期内中断写入。
  • PCB 布局:TSSOP-8 为小型封装,焊盘设计遵循制造商推荐尺寸;SPI 信号线短且避免与高频噪声源并行。

六、封装与机械信息

  • 封装类型:8 引脚 TSSOP(薄型小脚距封装)
  • 适合集成于 SMT 生产流程,便于自动贴装与回流焊接
  • 设计时参考 ST 提供的封装尺寸与焊盘推荐,保证可靠焊接与热属性

七、总结

M95M01-DWDW3TP/K 为一款面向工业与高可靠性场景的 SPI 串行 EEPROM,具有 1 Mbit 的容量、宽电压工作范围、极高的写入耐久性(400 万次)以及 100 年级的数据保持能力。其 TSSOP-8 小封装与标准 SPI 接口使其易于在嵌入式系统中替换或集成,适用于需要长期稳定保存参数、日志与校准数据的各类应用。设计时请以 ST 的官方数据手册为最终依据,按照建议的时序与布局规范进行硬件与固件实现。

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