Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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VL53L4CDV0DH/1 是意法半导体(ST)出品的小型近程飞行时间(ToF)光学传感器,适用于短距离精确测距与物体存在检测。器件采用 SMD-12P(LGA12)封装,体积微小,便于在空间受限的便携或嵌入式产品中集成。该器件工作电压宽(2.6V3.5V)、温度范围宽(-30℃+85℃),在低功耗和宽环境温度条件下可稳定工作,线性测距范围覆盖 0cm~130cm,适配多类近距离感测场景。
VL53L4CDV0DH/1 的 LGA12 封装尺寸紧凑(4.4×2.4×1.0 mm),利于在窄边框、可穿戴设备、无人机和消费类电子产品中实现高密度布局。SMD 封装支持标准回流焊工艺,但在贴装与回流过程中需关注焊接温度曲线与接地/散热要求,以保证光学窗口及内部结构性能不受影响。
器件通过 I2C 接口与主控芯片通信,建议在 I2C 总线上配置合适的上拉电阻(典型值视系统电源与总线长度而定),并在电源端添加旁路电容(例如 0.1 μF 与 1 μF 组合)以抑制瞬态噪声。工作电压建议稳定在推荐范围内以确保测距精度与功耗表现;器件典型工作电流约 24 mA,在电源设计时应考虑峰值与休眠模式下的功耗预算。
总结:VL53L4CDV0DH/1 以其小尺寸、宽电压与温度范围、I2C 易用接口以及 0–130 cm 的线性测距能力,适合各种短距感测应用。合理的布局、供电与软件支持将帮助发挥该器件的测距精度与可靠性。若需进一步的引脚分配、时序或参考设计,请参考意法半导体官方数据手册与参考设计资料。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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