Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST STWD100NYWY3F
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ST(STMicroelectronics) STWD100NYWY3F
- Type
- ST
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- STWD100NYWY3F
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Supervisorand positions IC
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Features
- positions; Gate
- Electronic Component
- BM0000287449
- Reset
- 210ms
- Operating Temperature
- 40℃~+125℃@(TA)
- Operating Voltage
- 2.7V~5.5V
- Output Type
- Electronic Component
- Static Current(Iq)
- 13uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品简介
STWD100NYWY3F 是意法半导体（STMicroelectronics）推出的一款高性能监控和复位芯片，专为嵌入式系统和其他多种应用场景而设计。其核心功能为监控供电电压，并在发现异常时自动触发系统复位，从而有效保护系统的稳定性和可靠性。
主要特点
监控电压类型: STWD100NYWY3F 能够监控一个供电电压，并提供故障检测功能，确保系统在过压或欠压条件下能够安全复位，防止不可预知的操作。
开路漏极输出: 该芯片采用开路漏极或开路集电极输出结构，适用于需要与外部设备共同工作，且能够灵活连接不同负载的应用场景。此种输出方式可最大限度地减少对外部电路的影响，增加设计的灵活性。
低有效复位: STWD100NYWY3F 的复位功能为低有效。当监控电压超出规定范围时，芯片将输出低电平信号并触发复位，进一步保护系统组件。
复位超时: 其复位超时时间可调整，最低设置为 1.12 秒，这为系统提供了足够的时间来稳定运行，确保在电压恢复后能够正常工作。
宽工作温度范围: STWD100NYWY3F 的工作温度范围从 -40°C 到 125°C，符合工业级应用要求，能够适应恶劣的环境条件，使其适用于各种因环境变化而必须保持可靠性的应用场景。
表面贴装型封装: 该芯片采用 SOT-23-5 表面贴装型封装，尺寸小巧，适合高密度电路板设计，能够有效节省空间并提升集成度。
应用领域
STWD100NYWY3F 适用于众多工业控制、汽车电子、消费电子和通信设备等领域。它常被用于：
- 嵌入式系统中的电源监测和复位
- 工业设备的电压监控
- 汽车电子设备中的供电保护
- 医疗设备中的电源稳定性保障
- 消费类电子产品中的电源管理
工作原理
STWD100NYWY3F 通过内部电压监测电路不断监控输入电压。一旦监测到电压低于预设阈值，芯片立即将输出引脚拉至低电平，从而触发复位过程，确保连接的微控制器或逻辑单元得到及时复位。当电压恢复至正常范围后，芯片通过释放低电平信号让系统回归到正常运行状态。
竞争优势
相较于市场上的其他同类产品，STWD100NYWY3F 提供的高温范围与小巧的封装设计，使其在许多对空间和可靠性要求极高的应用中，展现出明显的优势。此外，开路漏极输出的设计使其能够与各种输入和输出设备灵活适配，符合现代电子设计的多样化需求。
结论
综上所述，STWD100NYWY3F 是一款集成度高、性能稳定且适用范围广泛的监控和复位芯片，凭借其优越的工作温度范围和灵活的封装设计，能够满足现代电子设备对电源管理和系统保护的不断增长的需求。无论在智能家居、工业自动化还是汽车电子等领域，STWD100NYWY3F 都能够为设计师提供可靠的解决方案，以保护系统组件并提升设备的整体性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
