Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述:BD140 PNP 晶体管
BD140是一款由意法半导体(STMicroelectronics)生产的高性能PNP型晶体管,广泛应用于各种电子电路中。其主要参数包括额定功率为1.25W、集电极电流Ic最大值为1.5A、集射极击穿电压Vce最大值为80V,能够满足较大功率和电流需求的应用场景。此晶体管采用TO-126封装,适合通孔安装,兼具良好的散热性能和稳定性。
BD140采用TO-126封装,具有标准的尺寸和引脚布局,便于与其他元件的组合使用。其设计考虑了电路布线的简便性,适合在不同类型的电路板中集成。在电源管理、音频放大和开关应用中,其封装设计有助于降低热阻,确保晶体管在高负载条件下运行可靠。
作为一款PNP型晶体管,BD140的主要电气特性如下:
在不同的Ic和Vce条件下,BD140的直流电流增益(hFE)最小值为40 @ 150mA,2V。这一增益特性使得BD140非常适合用于小信号放大器、电流转换器以及驱动电路等应用。同时,高增益能够在小信号输入下提供大的输出信号,极大提升应用的灵活性。
BD140晶体管的工作温度可达150°C(最高结温TJ),适合在较严苛的环境条件下使用。其高温能力使其能够在不同的工业和消费电子设备中广泛应用,如电动工具、家用电器和汽车电子等。
BD140晶体管适用于:
总体来看,BD140是一款性能优越、可靠性强的PNP型晶体管,因其多种卓越特性及广泛的应用领域,使其成为电子设计师和工程师在选用晶体管时的理想选择。无论是在工业、消费类电子产品,还是在汽车电子中,BD140都能发挥出色,其优良的增益、功率及耐压特性将确保产品的高效运转与稳定性。选择BD140,意味着选择了高性能与高可靠性并存的解决方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products