WMSIC Electronic Components

ST STL110N10F7

ModelSTL110N10F7
PackagePowerFLAT-8(5x6)
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) STL110N10F7
Type
ST
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
STL110N10F7
Electronic Component
1
Package
PowerFLAT-8(5x6)
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.224g
Electronic Component
1
Electronic Component
BM0058423978
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
136W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
100V
Capacitor(Ciss)
5.117nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

STL110N10F7 产品概述

概述

STL110N10F7 是一款高性能的 N 通道绝缘栅场效应管 (MOSFET),由意法半导体(STMicroelectronics)生产。凭借其优秀的电气特性和高可靠性,该器件广泛应用于各类电力电子领域,包括开关电源、马达驱动以及其他高频、高效能的电力转换系统。

主要特性

  1. 漏源电压 (Vdss): STL110N10F7 的最大漏源电压为 100V,使其适用于各种中等电压的应用。这一参数保证了器件在高电压环境下的稳定性和可靠性。

  2. 连续漏极电流 (Id): 在 25°C 的条件下,器件可承载高达 107A 的连续漏极电流(在适当的散热条件下获取),使其具备了出色的负载能力,能够满足高功率应用的需求。

  3. 导通电阻 (Rds(on)): STL110N10F7 在 Vgs = 10V、Id = 10A 的情况下,最大导通电阻仅为 6 毫欧。低导通电阻有助于降低功耗,改善效率,减小发热量。

  4. 阈值电压 (Vgs(th)): 当栅极-源极电压 Vgs 达到最大 4.5V 时,漏极电流可达到 250µA。这一特性为器件的驱动设计提供了灵活性,可适应多种控制电路。

  5. 栅极电荷 (Qg): 最大栅极电荷为 72nC (在 10V 下),这使得 STL110N10F7 具备较好的开关速度。较低的栅极电荷值有助于降低驱动电路的功耗,提升整体系统效率,适合高频开关应用。

  6. 最大工作温度范围: 工作温度范围为 -55°C 至 175°C,适合于高温环境下的应用,确保器件在极端条件下的可靠性。

  7. 功率耗散: 该器件的最大功率耗散能力为 136W(Tc),在良好的散热设计下,能够很好地管理热量,提升整体性能和寿命。

封装与安装

STL110N10F7 采用了 PowerFlat™(5x6mm)封装,具有优良的热管理和空间效率。表面贴装型的设计简化了PCB布局与组装过程,适用于高密度的电路设计。此外,使用封装内的优秀散热特性可以减少散热器的需求,进一步节省空间。

应用场景

STL110N10F7 MOSFET 适用于多种应用,包括但不限于:

  • 开关电源: 在 AC-DC 和 DC-DC 转换中发挥关键作用,提高能效和稳定性。
  • 电机驱动: 用于无刷直流电机(BLDC)及步进电机的驱动控制,提升系统性能。
  • LED 驱动: 广泛应用于LED驱动电源中,保证高效稳定的工作状态。
  • 汽车应用: 在汽车电子中,作为电源开关,保证电动车辆或传统汽车中的动力传输效率。

结论

STL110N10F7 作为一款高性能 MOSFET,凭借其卓越的电气特性和宽广的应用范围,是电力电子工程师们选择的理想元件。通过结合其高电流承载能力、低导通电阻、良好的热特性和能力,STL110N10F7 不仅提高了设计效率,也满足了日益增长的高效能电源系统的需求。在未来智能电源与自动化应用的推动下,这款 MOSFET 无疑将继续在电力电子市场上发挥重要作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.