Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST TSC213ICT
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) TSC213ICT
- Type
- ST
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- TSC213ICT
- Electronic Component
- 50V/V
- Electronic Component
- 1
- Package
- SC-70-6
- Electronic Component
- 100kHz
- Electronic Component
- Current Sense Amplifier
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Common Mode Voltage
- 300mV~26V
- Features
- Filter
- Electronic Component
- BM69417297
- Operating Temperature
- 40℃~+125℃
- Voltage
- ±26V
- Amplifier
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TSC213ICT 产品概述
一、产品简介
TSC213ICT是一款由意法半导体（STMicroelectronics）推出的高性能电流感应放大器，旨在满足各种电流监测和测量应用的需求。该产品特别适合于便携式设备、工业测量、能源管理和电池监控系统等广泛应用场景。借助其优异的电气特性和可靠的性能，TSC213ICT成为了许多设计工程师的首选元件。
二、关键参数与特性
供电电流与电压范围：
- 供电电流: TSC213ICT在工作时仅需要65µA的供电电流，这使得它非常适合用于低功耗应用，如移动设备和电池供电的系统。
- 供电电压范围: 该放大器支持宽广的供电电压范围，从2.7V到26V（单极性/双极性供电），具有较高的应用灵活性，可以适应不同电源设计。
电流检测能力：
- TSC213ICT专为电流检测设计，具备出色的电流检测精度。其输入补偿电压为100µV，意味着它能够有效地减小因温度变化或电源波动引起的偏差，从而提高测量的精度与稳定性。
带宽与响应速度：
- TSC213ICT的-3dB带宽为100kHz，使得其能够有效捕获快速变化的电流信号。在很多实时监测应用中，这一特性确保了数据的实时性和准确性。
- 其压摆率为0.85V/µs，保证了输出信号能迅速响应输入信号的变化，适用于动态负载的测量。
温度特性：
- 工作温度范围为-40°C到125°C，意味着TSC213ICT能够在极端的环境中工作，适合于汽车、工业及其它需要高工作温度范围的应用场景。
封装方式：
- TSC213ICT采用SC-70-6表面贴装封装，这种小型化的封装设计使其在PCB设计中更加灵活，能够满足紧凑型设备的空间要求。
电流输入偏置：
- 产品的输入偏置电流为28µA，较低的输入偏置电流确保了电流检测的精度和稳定性，减少了由输入阻抗造成的误差。
三、应用场景
TSC213ICT的设计旨在满足以下应用需求：
- 便携式设备: 由于其低功耗特性，非常适合用于智能手机、平板电脑等移动设备中进行电池状态监测。
- 电池管理系统: 在电池管理单元中，该放大器可用于实时监测电池电流，从而优化充放电过程，提高电池使用寿命。
- 工业自动化: 在电机控制和能量管理中，TSC213ICT可以监测设备的电流，从而提高系统的效率和可靠性。
- 智能电表: 该放大器能够为智能计量设备提供精准的电流测量，支持电力监测和负载分析。
四、总结
TSC213ICT是一个高效、灵活且适用于多种工业和消费电子应用的电流感应放大器。凭借其小型化封装、低功耗特点以及广泛的工作电压范围，它为设计工程师提供了出色的解决方案。选择TSC213ICT，您将能够在多个领域实现更精确的电流监测和控制，提高系统的整体性能与效率。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
