Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST M95020-DRMN3TP/K M95020
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) M95020-DRMN3TP / K
- Type
- ST
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- M95020-DRMN3TP/K
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- EEPROM
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Features
- Built-in positions(POR);;; Built-in (ECC); Built-in Latch(WEL)
- Electronic Component
- BM0265105897
- Electronic Component
- 2Kbit
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.7V~5.5V
- Interface Type
- SPI
- Electronic Component
- 400
- Clock Frequency(fc)
- 20MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M95020-DRMN3TP/K 产品概述
M95020-DRMN3TP/K 是由意法半导体（STMicroelectronics）推出的一款高性能 EEPROM 存储器，广泛应用于需要高温度耐受性及非易失性存储的应用场景。其设计主要适用于工业自动化、汽车电子、消费电子及其他需要可靠数据存储的设备。
1. 产品基本参数
该 EEPROM 的存储容量为 2Kb，其中采用了 256 x 8 位的存储结构，可以通过 SPI 接口进行高速数据传输。该器件的时钟频率高达 20MHz，这为系统提供了快速的数据读写能力，尤其在需要频繁更新数据的场合，能够显著提高系统的响应速率。
存储器的电压供电范围广泛，从 1.8V 至 5.5V，使其能够兼容多种电源环境，适合设计师在电源管理方面有更大的灵活性。此外，其写入周期时间为 4ms，确保了在需要快速写入的应用中，可以快速地完成数据更新操作。
2. 工作温度与可靠性
M95020-DRMN3TP/K 的工作温度范围为 -40°C 至 125°C，非常适合挑战性的工业和汽车应用。该器件能够在极端条件下稳定工作，保障了在关键应用场合的数据安全性和可靠性，为系统设计提供了信心。
3. 安装与封装
该存储器采用表面贴装型（SMD）的8-SOIC封装，尺寸为 0.154"（3.90mm 宽），使其在有限的安装空间内便于集成。表面贴装技术不仅可以提高生产效率，还能降低设备的总体占地面积，使其更适合现代小型化电子产品的需求。
4. 应用场景
M95020-DRMN3TP/K 适用于多种实际应用，包括但不限于：
- 汽车电子：如车载控制器、遥控钥匙及 ABS 系统等，这些设备通常需要在高温和低温环境下可靠存储数据。
- 工业自动化：在各种工业设备中，EEPROM 可以用于存储设备的配置信息、运行日志和参数设置，确保设备在断电后依然能快速恢复到正常运行状态。
- 物联网设备：随着物联网的快速发展，对低功耗和长期可靠性的需求日益增加，M95020-DRMN3TP/K 是此类设备中的理想选择。
- 消费电子：例如家用电器和智能手机等，EEPROM 可以用于保存用户设置、校准数据及其他重要信息。
5. 总结
M95020-DRMN3TP/K 是一款性能卓越、可靠性高的 EEPROM 解决方案，适用于对数据存储有着高要求的多种电子应用设备。凭借其广泛的额定电压范围、耐高温的能力及快速的读写速度，该产品在当今快速发展的电子市场上展现出了其独特的竞争力和应用价值。无论是开发新产品还是升级现有设备，M95020-DRMN3TP/K 都是一个值得考虑的优质选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
