Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM2901YPT 是意法半导体(STMicroelectronics)推出的一款高性能电压比较器,其设计目标是提供稳定、可靠的电路比较功能,广泛应用于各种电子设备和系统中。这款产品的广泛适用性源于其优越的电气性能和适应性,包括多种输出类型、供电电压范围和温度范围,使其成为工程师和设计师的理想选择。
LM2901YPT 是一种通用型的比较器,具有四个集成比较器电路,这意味着在一个封装中可以实现多个比较功能,节省了电路板的空间及设计复杂性。该器件支持 CMOS、DTL、ECL、MOS、开路集电极以及 TTL 输出类型,使其能够适应多种不同的应用场景。
为了保证它在不同供电条件下的稳定性,LM2901YPT 的供电电压范围广泛,支持单电源供电(2V至32V)以及双电源供电(±1V至±16V)。这使得它可以灵活应用于各种电源条件的设计中。同时,其输入补偿电压最大值为 7mV @ 5V,确保了在微小电压差异下也能提供准确的比较结果。其输入偏置电流最大值为 0.25µA @ 5V,这一低偏置电流特性允许 LM2901YPT 在低功耗的应用中表现出色。
在输出性能方面,LM2901YPT 通常可以输出高达 16mA 的电流,这对于驱动后续电路至关重要。而且,器件的静态电流最大值为 2.5mA,这意味着在待机模式下,它占用的功率相对较低,有利于节能设计。相比于传统的比较器,LM2901YPT 在各种条件下的电性能稳定,能够更好地满足现代电子设备对性能和功耗的双重要求。
LM2901YPT 具有优越的工作温度范围,从 -40°C 到 125°C,确保其在极端环境下的稳定运行。这一特性使其非常适合于汽车、工业控制、消费电子及其他对温度敏感的领域,如环境监测和医疗设备。
LM2901YPT 采用 14-TSSOP(Thin Shrink Small Outline Package)封装,尺寸小巧,便于表面贴装,适应现代电子设备对空间的需求。其封装的实用性使得设计师能够在密集的电路板布局中轻松集成,无需担心会占用过多的空间。
LM2901YPT 的应用场景非常广泛,包括但不限于:
LM2901YPT 是一款高性价比、多功能的电压比较器,凭借其优异的电气特性、宽广的应用范围、低功耗以及宽温度工作能力,成为各类电子设计的优先选项,特别是在需要高可靠性和小尺寸的应用场合中,展示出其独特的优势。设计师只需简单集成,即可实现高效稳定的比较功能,从而提升整体产品的性能和可靠性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products