WMSIC Electronic Components

ST M24C32-DFMC6TG M24C32

ModelM24C32-DFMC6TG
PackageUFDFPN-8(2x3)
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) M24C32-DFMC6TG
Type
ST
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
M24C32-DFMC6TG
Electronic Component
1
Package
UFDFPN-8(2x3)
Electronic Component
EEPROM
Electronic Component
0.001g
Electronic Component
1
Features
Built-in positions(POR);; Built-in (ECC)
Electronic Component
BM0084329909
Electronic Component
32Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
400
Clock Frequency(fc)
400kHz~1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:M24C32-DFMC6TG

一、概述

M24C32-DFMC6TG是由意法半导体(STMicroelectronics)推出的一款高性能、低功耗的32Kb(4K x 8)非易失性存储器。它基于EEPROM(电可擦可编程只读存储器)技术,采用I²C串行接口,适用于多种需要保存数据的电子应用。这款EEPROM在高温和低温环境下均能稳定工作,非常适合在苛刻的工业和商业应用场景中使用。

二、技术规格

  1. 存储器类型:非易失性存储器技术保证数据在断电后依然保存。
  2. 存储容量:32Kb,这意味着可以存储4K个字节的数据,适合需要中小容量存储的应用。
  3. 接口类型:I²C接口,具有双向数据传输的能力,支持多设备连接,便于与其他组件集成。
  4. 时钟频率:1MHz,确保数据传输速率达到要求,保证性能。
  5. 写周期时间:每字节和每页写入所需的时间均为5ms,适合对速度要求不高的应用。
  6. 访问时间:450ns,提供快速的数据读取性能,能够满足大多数实时应用需求。
  7. 工作电压范围:1.7V ~ 5.5V,广泛的供电电压范围适应不同的应用需求和电源设计。
  8. 工作温度:-40°C ~ 85°C,确保在各种环境条件下的可靠性,适用于工业级的应用场合。
  9. 安装类型:表面贴装型设计,使其适合现代自动化生产线的组装。
  10. 封装形式:8-UFDFPN(2x3),该封装设计有效减少了电路板的占用面积,并方便在高密度电路中的应用。

三、应用领域

M24C32-DFMC6TG广泛应用于以下领域:

  1. 工业控制系统:可用于存储配置数据和参数设定。
  2. 智能仪表:在智能传感器和仪器中使用,保存校准信息和历史数据。
  3. 汽车电子:在汽车无线通信系统、车载信息系统等需要数据非易失性的场合。
  4. 消费电子:适用于家电、音响设备中的数据存储需求。
  5. 智能卡和电子标签:在各类智能卡和标签中,保存用户信息及交易数据。

四、产品优势

  1. 高可靠性:非易失性存储器技术保证在断电时数据完整;并且其工作温度范围广,适应多种环境使用。
  2. 灵活性:支持I²C接口,使其很容易与多种主控芯片进行配合,简化了系统设计。
  3. 小型封装:8-UFDFPN(2x3)小型封装设计,使产品在高密度布局中更具优势,节省了PCB空间。
  4. 低功耗表现:在工作和待机模式下均可实现低功耗,适合电池供电的便携式设备。

五、总结

M24C32-DFMC6TG是一款功能强大、可靠性高、适用范围广的EEPROM存储器,适合多种工业和商业应用。其低功耗设计和广泛的工作电压及温度范围,使其成为当前市场上的理想选择。通过在多种产品中实现数据的非易失性存储,意法半导体为工程师提供了一种通用的解决方案,帮助他们开发出更加智能和高效的电子产品。随着工业物联网和智能电子设备的快速发展,M24C32-DFMC6TG将在未来继续发挥其重要作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.