Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M95256-DFMC6TG 是一款由意法半导体(STMicroelectronics)生产的高性能 EEPROM 存储器,具有多种应用场景和特定指标,使其成为嵌入式系统中非易失性存储的理想选择。该器件采用 SPI(Serial Peripheral Interface)协议进行数据传输,具有支持高达 20MHz 的时钟频率,确保数据的快速读写。
M95256-DFMC6TG 提供 256Kb(32K x 8 位)的存储容量,能够满足多种数据存储需求。非易失性存储器的特性允许数据在断电后仍然保持,从而提供了更高的数据安全性和可靠性。这使得 M95256 在需要长期存储配置、参数和日志数据等场景中表现优异。
M95256-DFMC6TG 支持宽电压供电范围,从 1.7V 到 5.5V,适应各种电源管理方案。其低电压特性使其特别适合在便携式设备和电池驱动的应用中使用,同时在较高电压应用中也能保持良好的性能。
该器件的工作温度范围为 -40°C 至 +85°C,使其适用于各种恶劣环境和工业应用。这一温度范围保证了 M95256 在高温、低温或极端条件下均能稳定工作。
在写入性能方面,M95256 的字写周期时间为 5ms,这意味着即使在频繁的数据更新情境下,也能保持相对较快的响应速度。它的页写入操作允许多个字节的同时写入,从而提高了数据处理效率。
M95256-DFMC6TG 采用表面贴装型(SMD)封装,具体为 8-UFDFN(2x3 mm)形式。该封装设计不仅节省了电路板空间,同时也提供了良好的热性能和电气性能,适配现代高密度电路板设计需求。裸露焊盘的设计确保了优良的焊接质量和组装效率。
M95256-DFMC6TG 的多项特点使其适用于各类应用场景,包括但不限于:
M95256-DFMC6TG 作为一款高性能、宽电压范围、适应极端环境的 EEPROM 存储器,提供了强大的数据存储解决方案,广泛适用于各种现代电子设备中。其优秀的技术参数和出色的工作稳定性,使其在日益复杂的电子应用中显得尤为重要。无论是在消费电子还是在工业自动化领域,M95256-DFMC6TG 都能为设计师提供可靠的存储解决方案,助力不断发展的智能设备和系统。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products