WMSIC Electronic Components

ST ESDA6V1L

ModelESDA6V1L
PackageSOT-23
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) ESDA6V1L
Type
ST
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
ESDA6V1L
Electronic Component
1
Package
SOT-23
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.053g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
140pF
Electronic Component
BM0264967348
Operating Temperature
40℃~+125℃
Voltage
6.1V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ESDA6V1L

ESDA6V1L是一款由意法半导体(STMicroelectronics)生产的高性能瞬态电压抑制(TVS)二极管,专为保护敏感电子设备免受瞬态电压和过电压事件而设计。该二极管采用表面贴装型封装(SOT-23-3),具有良好的热性能和小型化特点,适合空间受限的应用场景。

基本参数

ESDA6V1L的工作电压范围确保其能有效应对多种瞬态电流事件,以下是该器件的一些关键电气特性:

  • 击穿电压(最小值):6.1V
  • 反向关断电压(典型值):5.25V
  • 极性:支持双向(Bidirectional)和单向(Unidirectional)应用
  • 峰值脉冲电流(10/1000us):20A (8/20us)
  • 箝位电压:16V
  • 功率 - 峰值脉冲:300W

应用领域

ESDA6V1L适用于需要电源线路保护的应用,如通信设备、工业电子、消费电子和汽车电子等。在这些应用中,设备通常会暴露于静电释放(ESD)、雷击、浪涌电流等瞬态电压事件,因此对保护器件的性能要求极高。ESDA6V1L的低反向关断电压和高击穿电压使其能够在各种工作条件下为元器件提供有效保护。

工作温度范围

该二极管的工作温度范围为-40°C至125°C,广泛的温度适应性使其适用于各种工业和商业环境,确保在苛刻条件下也能稳定工作。

安装类型

ESDA6V1L采用表面贴装型设计,其封装符合SOT-23-3标准,使得其在现代高密度电路板设计中极具优势。该设计不仅容易焊接和集成,还能显著节省空间,适合于小型化设备的需求。

特性及优势

  1. 瞬态抑制能力强:相较传统的保护二极管,ESDA6V1L具有更高的瞬态电压抑制能力,能够快速响应电压尖峰并有效钳制电压到安全水平。

  2. 低泄漏电流:在正常工作状态下,ESDA6V1L的低泄漏电流特性降低了对电路的功耗影响,有助于提高系统的整体效率。

  3. 高重复性:ESDA6V1L经过严格的测试设计,以确保其在多次瞬态事件中保持稳定的抑制性能,降低了故障风险。

  4. 可靠性高:产品在严格的环境测试下表现优越,适合要求高可靠性的关键应用。

综上所述,ESDA6V1L是保护电子设备免受瞬态电压和过电压影响的理想选择,其优异的性能、广泛的应用性及高可靠性使其成为现代电子设计中不可或缺的保护元件。无论是在智能手机、平板电脑、通讯设备还是工业控制系统中,ESDA6V1L都能提供持久的保护,确保设备的安全性和稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.