WMSIC Electronic Components

ST M24C04-WDW6TP M24C04

ModelM24C04-WDW6TP
PackageTSSOP-8
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) M24C04-WDW6TP
Type
ST
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
M24C04-WDW6TP
Electronic Component
1
Package
TSSOP-8
Electronic Component
EEPROM
Electronic Component
0.147g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0000285211
Electronic Component
4Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Interface Type
I2C
Electronic Component
400

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:M24C04-WDW6TP EEPROM

概述

M24C04-WDW6TP是意法半导体(STMicroelectronics)旗下的一款高性能EEPROM存储器,广泛应用于需要数据存储和管理的各种电子设备中。该器件采用表面贴装型(SMD)封装,符合现代电子产品对小尺寸和高集成度的要求。其主要特性包括4Kb的存储容量、工作温度范围为-40°C至85°C、和2.5V至5.5V的供电电压。由于其非易失性特征,M24C04-WDW6TP能够在电源关闭的情况下保持存储数据,确保重要数据的安全性和可靠性。

主要特性

  • 存储容量:M24C04-WDW6TP提供4Kb(512 x 8位)的存储空间,能够有效满足中小型数据存储需求,适用于各类应用。

  • 接口技术:器件采用I²C通信接口,支持最高400kHz的时钟频率,使得数据传输速度快速且稳定,适应多种数据读取和写入的需求。

  • 访问时间:设备的读取和写入访问时间为900ns,写周期时间为5ms(字节和页写),这使得M24C04-WDW6TP在数据处理速度上表现良好。

  • 电源电压范围:M24C04-WDW6TP支持广泛的供电电压(2.5V ~ 5.5V),具备良好的电源兼容性,适合多种电池供电及低功耗设备使用。

  • 温度范围:该器件设计温度范围为-40°C至+85°C,适应于严苛环境下的工作需求,非常适合工业和汽车等领域的应用。

  • 封装类型:采用8-TSSOP封装,占用空间小,便于在密集的PCB布局中实现高密度配置。

应用场景

M24C04-WDW6TP的设计使其适用于多种行业和应用,具体包括:

  1. 消费电子:在电视、音响、家电等产品中用作配置数据存储。

  2. 工业控制:在PLC、传感器和执行器中存储参数和配置值,确保设备在断电后仍能正常运行。

  3. 汽车电子:在汽车引擎管理系统、仪表盘和车载娱乐系统中存储关键信息。

  4. 医疗设备:在监护仪和其他医疗设备中,可以用来记录病人数据和设备参数,以保证数据的准确性与安全性。

  5. 通信设备:在路由器、交换机和其他网络设备中存储网络配置数据。

竞争优势

与其它类型的非易失性存储器相比,M24C04-WDW6TP提供了多个显著优势。首先,其非易失性特点确保了数据在供电中断时不会消失,保证了数据安全。其次,快速的访问时间和宽广的温度工作范围使其非常适合在各种环境中使用。此外,I²C接口的设计也为嵌入式系统提供了简单而高效的集成方式。最后,意法半导体作为行业领先的元器件制造商,其产品质量和技术支持也是用户选择M24C04-WDW6TP的重要考虑因素。

结论

总之,M24C04-WDW6TP是一款功能强大、灵活且可靠的EEPROM存储解决方案。凭借其优越的性能和广泛的适用性,它特别适合需要稳定性和耐用性的各种应用。随着电子设备日益向小型化、功能化方向发展,M24C04-WDW6TP作为解决方案的潜力将不断被挖掘,为用户带来更高效、更安全的存储体验。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.