WMSIC Electronic Components

ST VD6283TX45/1 VD6283TX45

ModelVD6283TX45/1
PackageBGA-6
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) VD6283TX45 / 1
Type
ST
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
VD6283TX45/1
Electronic Component
1
Electronic Component
1mm
Package
BGA-6
Electronic Component
Ambient Light Sensor
Electronic Component
0.44g
Electronic Component
1.83mm
Electronic Component
0.55mm
Resolution
24bit
Electronic Component
1
Features
Low Power /; Gain Control
Electronic Component
BM0264249195
Operating Temperature
30℃~+85℃
Operating Voltage
1.65V~1.95V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VD6283TX45/1 环境光与颜色传感器产品概述

一. 概述

VD6283TX45/1 是意法半导体(ST)推出的一款高集成度环境光与颜色识别传感器,采用 BGA-6 封装(尺寸 1.83 mm × 1.00 mm × 0.55 mm),针对对体积、功耗和光学性能有严格要求的便携设备与消费电子应用。器件支持颜色识别与光强测量,感光能力可覆盖至 30 klx,分辨率高达 24-bit,能够在宽动态范围内提供高精度的光学数据。

二. 主要特性

  • 感测类型:颜色识别(R/G/B/透明)与环境光(可见光/红外)强度测量。
  • 检测波段:红色、绿色、蓝色、红外、可见光及透明(用于薄膜/玻璃等透明目标识别)。
  • 感光能力:最高可测 30,000 lux,适应室内至强日光场景。
  • 分辨率:24-bit 数字输出,支持高精度色彩与光照测量。
  • 接口:I²C,总线通信便于与 MCU/应用处理器集成。
  • 工作电压:1.65 V ~ 1.95 V(典型 1.8 V),适合超低功耗系统。
  • 工作温度:-30 ℃ ~ +85 ℃。
  • 功能:低功耗与睡眠模式、可调增益控制(通过寄存器配置增益/积分时间以优化信噪比)。

三. 应用场景

  • 智能手机与平板:自动亮度/色温调节、显示器自适应与拍照白平衡辅助。
  • 可穿戴设备与耳机:在极小封装中实现环境光感知与色彩识别,延长续航。
  • 智能照明与家居:分光识别用于情景照明与话务器件光学控制。
  • AR/VR 与相机模块:环境色彩感知用于渲染与自动曝光/白平衡校正。
  • 工业与检测设备:透明材料检测、色差比对与生产线快速分选。

四. 系统集成建议

  • 电源与解耦:器件运行电压窄且偏低,推荐使用稳定的 1.8 V 电源并在 Vdd 旁放置 0.1 µF 陶瓷去耦电容,靠近器件引脚布局。
  • I²C 总线:需外部上拉电阻。若主控工作电压高于 1.95 V,请采用电平移位或使用支持多电压的 I²C 集线器。
  • 光学窗口与布局:在 PCB 顶层开窗并避免遮挡光路;合理安置遮光槽以减少侧入光与杂散反射影响测量精度。
  • EMC 与 ESD:采用适当的 ESD 保护措施并遵循 BGA 焊接工艺以保证可靠性。

五. 封装与装配注意

BGA-6 超小封装维持了极小 PCB 占用,但对回流焊温控、焊盘设计与掩膜对齐有较高要求。建议按照 ST 的封装说明书设计焊盘过孔与回流曲线,并在生产前进行首批样件的焊接与光学性能验证。

六. 小结

VD6283TX45/1 以其 24-bit 高分辨率、小体积 BGA-6 封装、宽光谱颜色识别能力与低功耗特性,适合对尺寸与能耗有严格约束的便携与嵌入式产品。通过寄存器级的增益与积分时间控制,可在从昏暗室内到强日光的广泛照度条件下实现稳定、精确的光学测量。集成时应重视电源稳定、I²C 电平匹配与光学封装设计,以确保传感器性能发挥。

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