Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
STG719STR 是意法半导体(STMicroelectronics)推出的一款高性能表面贴装型开关IC,采用SOT-23-6封装。这款器件主要设计用于高频信号处理和多路复用/解复用应用,其广泛应用于通信、消费电子、工业控制等领域,得益于其优良的性能与可靠的稳定性。
开关类型与配置: STG719STR 是一种单通道的2:1多路复用器/解复用器,提供单刀双掷(SPDT)开关电路,能够高效地选择两个信号源中的一个进行输出。这种配置在需要动态信号选择的场合中非常常见,例如在选择音频信号源或数据通道时。
电源电压范围: 工作电压范围为1.8V至5.5V,使其适应于多种工作环境,尤其是现代低电压系统和便携式设备。宽广的电压范围不仅提升了设计的灵活性,也有助于与多种电源系统兼容。
低导通电阻: STG719STR 的导通电阻最大值为4Ω,这意味着它在导通时能够提供极低的信号损失,从而在高频信号处理上实现更高的传输效率。这一特性在高频应用中显得尤为重要,因为较低的导通电阻可以减少信号衰减,确保信号的完整性。
高速开关性能: 具有卓越的开关速度,最大开关时间(Ton和Toff)分别为7ns和4.5ns,使得该部件能够应对快速变化的数字信号。这一特性使STG719STR 适合用于高速数据总线、视频信号切换等场合,满足现代高速通信系统的需求。
低功耗与低漏电流: STG719STR 最大漏电流(IS(off))为250pA,确保器件在非工作状态下能够保持低功耗,使其成为便携式设备和便于节能的应用场合的理想选择。
优异的带宽和串扰性能: 器件的-3dB带宽为200MHz,适用于高频信号的传输,同时其串扰性能达到-52dB @ 1MHz,确保不同通道之间的信号不会相互干扰,有助于提升多路复用应用的信号质量。
高稳定性工作温度范围: STG719STR 的工作温度范围宽广,从-55°C至125°C,这使得该部件可在恶劣环境下稳定工作,适合各种工业和汽车应用的要求。
紧凑的封装: SOT-23-6封装设计使得STG719STR 在空间受限的应用中尤为有利,支持高密度的PCB布局,提高了系统集成度。
STG719STR 广泛应用于多个领域,包括但不限于:
综上所述,STG719STR 作为一款高性能的表面贴装型开关IC,凭借其优异的电气特性、宽广的工作电压及温度范围,成为信号传输和选择应用中的理想选择。无论是在高速数字电路还是音频信号处理应用中,其卓越的性能均能满足设计工程师的高要求。STMicroelectronics 以其领先的技术和可靠性,为客户提供了高质量的电子元件解决方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products