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ST STPS2H100ZFY
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) STPS2H100ZFY
- Type
- ST
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- STPS2H100ZFY
- Electronic Component
- 1
- Package
- SOD-123F
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.059g
- Electronic Component
- 1
- Electronic Component
- BM0228744805
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 1uA@100V
- (Vf)
- 960mV@4A
- Electronic Component
- 40℃~+175℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
STPS2H100ZFY 产品概述
一、概述
STPS2H100ZFY 为意法半导体（ST）出品的一款肖特基整流二极管，面向中功率开关电源和高频整流应用。该器件在较高反向电压下保持低反向漏电，并在大电流冲击时具有良好耐受能力，适合作为整流、自由轮回和反向保护元件。
二、主要电气参数
- 正向压降 Vf = 960 mV @ 4 A（典型测试点），在高电流条件下表现稳定。
- 直流反向耐压 Vr = 100 V，可用于中等电压回路。
- 平均整流电流（标称） = 2 A，适合板载整流和功率二极管替代场景。
- 反向漏电流 Ir = 1 μA @ 100 V（室温条件下），低漏电利于提高待机效率和降低热量。
- 非重复峰值浪涌电流 Ifsm = 50 A，可承受启动或短时浪涌应力。
- 工作结温范围：-40 ℃ 至 +175 ℃，耐高温能力优于一般通用二极管。
三、封装与热性能
该器件采用 SOD-123F 贴片封装，体积小、适合自动贴装与回流焊工艺。由于封装所限，平均功率散热依赖于PCB的铜箔面积和散热设计，推荐在正负极焊盘处增加铜箔面积并使用过孔与下层散热平面以降低结温并提高连续载流能力。
四、典型应用
- 开关电源输出整流与同步整流替代；
- DC-DC 转换器、降压/升压模块的整流与自由轮回二极管；
- 充电器与适配器的整流与反向保护；
- 逆变器、太阳能微型逆变及汽车电子中需要低压降和快速恢复的场合。
五、使用与布局建议
- 在靠近二极管焊盘处布置充足铜皮（推荐多平方厘米级别，根据散热需求调整），并使用热过孔将热量传导到内层或底层铜箔；
- 在高电流回路中保持走线短且宽，减少寄生电阻和电感；
- 考虑正向压降在满载时产生的功耗（P ≈ Vf × I），据此计算结温并适当降额运行；
- 焊接遵循IPC/JEDEC回流曲线，避免超温或过长回流时间。
六、可靠性与注意事项
- 虽然室温下反向漏电仅为微安级，但随温度上升漏电会快速增加，设计时需考虑高温条件下的漏电及由此产生的额外功耗；
- 若电路存在频繁的大幅反向电压或高温＋高电压组合，应验证实际漏电与热失控风险；
- 非重复峰值浪涌能力可处理短时冲击，但不建议作为长期过载方案。
七、选型建议
若系统要求更低的正向压降或更高平均电流，应优先考虑更大功率封装或并联使用；若对漏电十分敏感（例如高压逆变或能量回收场景），需要在实际温度下验证 Ir 曲线。STPS2H100ZFY 在中等电压（100V）与中等连续电流（≈2A）场合提供了一种体积小、成本效益好的肖特基解决方案。
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