Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SM2T3V3A是一款意法半导体(STMicroelectronics)生产的表面贴装型齐纳二极管,主要设计用于电路过压保护和电源线路保护。该产品采用DO-216AA封装,呈现出紧凑的设计,便于在空间有限的电路板上进行安装。这款二极管的主要特点包括其高效的电压夹制、优异的热稳定性以及出色的瞬态响应性能,这使得其在电路保护方面表现出色。
安装类型: SM2T3V3A 为表面贴装型(SMD),适合高密度电路板设计。表面贴装技术(SMT)使得电路板制造更为高效,并提高了组件的可靠性和性能。
电压 - 夹位(最大值): 本产品的最大夹位电压达到6.8V,能够有效保护后端电路免受瞬时电压冲击的影响。在高频应用或高速开关电路中,这一特性尤其重要。
功率 - 峰值脉冲: SM2T3V3A的峰值脉冲功率高达200W,能够承受强烈的瞬态电流,适用于多种电气环境。这种高功率处理能力意味着它可以在不失效的情况下,承受短时间内的高电压脉冲。
电流 - 峰值脉冲(10/1000µs): 其最大峰值脉冲电流为30A,使其在保护电路时具有更高的瞬态响应能力,特别适合防止瞬态电流带来的损坏。
电压 - 反向断态(典型值): 3.3V的反向断态电压使得此二极管在常态工作时能够有效地抑制可能出现的反向电流,确保电路的安全和可靠性。
电压 - 击穿(最小值): SM2T3V3A 的最小击穿电压为3.6V,这一数值保证了在工作状态下,该二极管能够及时响应电压异常,保护敏感设备不受损害。
SM2T3V3A 的设计符合行业标准,适用于各种通用应用,包括:
SM2T3V3A 代表了意法半导体在二极管领域的技术实力,凭借其多项优秀性能和广泛的应用场景,成为了现代电子产品中不可或缺的保护元件。不论是在商用还是工业环境中,SM2T3V3A 都为设计师和工程师提供了一种可靠的解决方案,以应对日益复杂的电路保护需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products