WMSIC Electronic Components

ST LD1117DT18TR

ModelLD1117DT18TR
PackageDPAK
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) LD1117DT18TR
Type
ST
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.2V@(800mA)
Electronic Component
ST(STMicroelectronics)
Electronic Component
100uV
Electronic Component
LD1117DT18TR
Electronic Component
1
Package
DPAK
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.51g
Electronic Component
1
Electronic Component
BM0263669162
Operating Temperature
0℃~+125℃@(Tj)
Operating Voltage
15V
Output
Electronic Component
Output Voltage
1.8V
Output Current
800mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LD1117DT18TR 产品概述

一、基本信息

LD1117DT18TR是一款高性能的线性稳压器(LDO),由意法半导体(STMicroelectronics)生产。其封装类型为DPAK(TO-252-3),适用于表面贴装(SMT)。该稳压器专门设计用于为各类高性能电子设备提供稳定的输出电压,输出电压为1.8V,最大输出电流为800mA,广泛应用于通信、消费电子以及工业控制等领域。

二、主要参数

  1. 输出电压: 1.8V(固定),适合对电压要求严格的应用场合。
  2. 输出电流: 最大可达800mA,这一输出能力使其可以驱动多种电子负载。
  3. 输入电压范围: 最大输入电压为15V,这使得该LDO能够支持多种输入电源类型,适应性强。
  4. 压降: 在800mA输出电流下,最大压降为1.2V,典型值为1.1V,这保证了在高负载下仍能有较好的功率传输效率。
  5. 静态电流: 该稳压器在无负载情况下的静态电流为10mA,确保有效能耗管理,适合低功耗应用。
  6. 工作温度范围: 支持的工作温度范围为0°C至125°C,适合各种环境下使用。
  7. 湿气敏感性等级(MSL): 1(无限),便于焊接与处理,适合于自动化生产线。
  8. 保护功能: 内部具有过流和超温保护功能,提升了系统的安全性与稳定性。

三、应用领域

LD1117DT18TR广泛应用于:

  • 移动通信设备:如智能手机、平板电脑等,需要稳定的电源。
  • 消费电子:如数字相机、游戏机等,提供可靠的电源管理方案。
  • 嵌入式系统:如嵌入式处理器平台,需保证稳定供电,避免电压波动对系统造成影响。
  • 汽车电子:车载电子设备,如导航仪、音响系统等,具备良好的温度适应能力。

四、功能特性

LD1117DT18TR具备优异的电源抑制比(PSRR),在120Hz时达到75dB,可以有效抑制输入电源中的噪声,保证输出电压的清洁性。此外,该产品具备单稳压器,具有简单直观的电路设计,便于集成在各种应用中。

五、总结

LD1117DT18TR是一款性能优越且可靠性高的线性稳压器,凭借其固定输出电压、较高的输出电流、以及相对宽的工作温度范围,它在现代电子设计中找到了众多应用场合。意法半导体作为知名半导体制造商,其产品的质量和性能在业界有着良好的口碑。对于需要稳定电源的用户来说,LD1117DT18TR无疑是一个值得考虑的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.