WMSIC Electronic Components

ST VIPERGAN50TR

ModelVIPERGAN50TR
PackageQFN-15(5x6)
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) VIPERGAN50TR
Type
ST
Minimum package
4000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
VIPERGAN50TR
Electronic Component
1
Package
QFN-15(5x6)
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
1g
Electronic Component
1
Features
Brown-in / Brown-out;;; (OTP);; (UVP); EMI Optimization; /; (OVP)
Electronic Component
Electronic Component
Electronic Component
BM0265442564
Electronic Component
QR
Operating Temperature
40℃~+150℃
Operating Voltage
9V~23V
Switching Frequency
240kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VIPERGAN50TR AC-DC控制器产品概述

一、产品定位与核心属性

VIPERGAN50TR是意法半导体(ST) 推出的集成式隔离AC-DC控制器+稳压器,专为中小功率(50W) 电源设计,兼具高效能、高可靠性与小型化特点,可满足消费电子、工业、车载等多领域的电源需求。作为隔离型方案,它无需额外隔离器件,简化了电源系统架构。

二、关键技术参数解析

1. 电压与功率范围

  • 工作电压:9V~23V,覆盖常见辅助电源电压区间,兼容多种输入源;
  • 晶体管耐压:650V,适配全球110V/220V市电输入,无需额外高压器件,降低系统成本;
  • 功率等级:50W,满足中小功率设备(如适配器、LED驱动)的核心供电需求。

2. 频率与温度特性

  • 开关频率:240kHz固定频率,高频设计可减小变压器体积,优化PCB布局空间;
  • 工作温度:-40℃~+150℃宽温范围,适应工业环境(如-20℃低温、125℃高温)、车载场景等恶劣工况。

三、拓扑结构与工作模式优势

1. 反激式拓扑(Flyback)

反激拓扑是隔离电源的成熟方案,具备宽输入电压范围(适配市电波动)、简单变压器设计(无需复杂绕组)等优势,适合中小功率隔离电源。

2. QR准谐振工作模式

VIPERGAN50TR采用谷值开关(Valley Switching) 的QR模式:开关管关断后,变压器漏感与输出电容发生谐振,开关管在电压谷值时导通——这一设计可大幅降低开关损耗,提升转换效率(可达85%以上),同时减少EMI电磁干扰,降低外围滤波成本。

四、多重保护机制保障可靠性

产品内置3项核心保护功能,从硬件层面提升系统稳定性:

  • 过热保护(OPT):芯片温度超过阈值(如150℃)时自动关断,防止连续负载下烧毁;
  • 欠压保护(UVP):输入电压低于9V时停止工作,避免低电压下输出不稳定,保护后端负载;
  • 过压保护(OVP):输出电压异常升高时切断输出,防止负载过压损坏。

这些保护无需额外外围电路,简化设计的同时,降低了系统故障风险。

五、封装与应用场景

1. 小型化封装

采用QFN-15(5×6mm) 表面贴装封装,体积紧凑,适合高密度PCB设计(如笔记本适配器、机顶盒电源模块),可有效节省产品内部空间。

2. 典型应用场景

  • 消费电子:笔记本电脑适配器、机顶盒电源、智能音箱供电;
  • 工业领域:PLC辅助电源、传感器模块供电;
  • 照明行业:中小功率LED驱动电源;
  • 车载场景:车载充电器、车载显示屏供电(宽温特性适配)。

六、核心应用价值

  1. 高效节能:QR模式降低开关损耗,符合能源之星、欧盟ERP等能效标准;
  2. 设计简化:集成控制器与高压晶体管,减少外围器件(如MOS管、驱动电路),缩短开发周期;
  3. 成本优化:小体积封装+集成化设计,降低物料成本与PCB空间成本,适合量产;
  4. 高可靠性:宽温范围+多重保护,减少售后故障,提升产品使用寿命。

VIPERGAN50TR通过集成度、效率与可靠性的平衡,成为中小功率隔离电源的高性价比选择,可快速适配不同行业的电源设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.